Presented by Eric Stafstrom, Technic Global Products Manager, and Denis Jacques, Technic Director of PCB Services, Technic’s paper covers three topics. First, why immersion silver is a great choice as a final finish for 5G millimeter-wave applications. Secondly, a review of the failure mechanisms for issues like creep corrosion and champagne voids with initial formulas. And finally, how through the use of a novel slightly alkaline nitrate-free formula, the paper offers a solution to eliminate the main cause for these issues, porosity and aggressive copper attack of the original formulas.