Technic is reporting increased market demand of its advanced gold-tin electroplating process, Elevate^® AuSn 8020. The company attributes the increased demand to a significant expansion in the manufacture and use of 5G capable wireless devices, LiDAR remote sensing technology, and Data Center Interconnect (DCI) technology.

Due to advances in 5G, LiDAR, and DCI, requests for high-reliability solder that meets new manufacturing requirements have surged substantially. Gold-Tin solder has become the standard in integrated photonic interconnections due to several unique properties that make it an ideal process. These include favorable soldering temperature (300 – 310 ^oC), high strength, fluxless assembly, and optimum wetting performance.