High-Performance Copper Plating Process for a wide range of feature types

Cranston, RI, USA – Technic is pleased to announce the full commercial release of Elevate Cu 6370, a versatile electrolytic copper plating process for semiconductor advanced packaging applications.

Over the past two years, Elevate Cu 6370 has been in limited release and used in a wide variety of applications. With slight modifications to the electrolyte, Elevate Cu 6370 has been highly successful in tight RDL patterns, standard pillars, 200-micron tall mega pillars, bump on passivation structures, and other advanced packaging structures.  The process is ideally suited for a variety of semiconductor advanced packaging platforms, including FOWLP (Fan-Out Wafer Level Packaging) Fan-In Wafer Level Packaging, and 2.5D/3D.

Technic announces the release of the Techni Indium HS pure Indium plating process.  This process is designed for use in the selective plating of press fit pin connectors in order to prevent the formation of harmful metallic whiskers.

Technic has performed extensive in-house and field testing of the Techni Indium HS process which has shown the electrolyte is very robust, with deposits that are exceptionally whisker resistant. The current density range of the process is extremely