High-Performance Copper Plating Process for a wide range of feature types
Cranston, RI, USA – Technic is pleased to announce the full commercial release of Elevate Cu 6370, a versatile electrolytic copper plating process for semiconductor advanced packaging applications.
Over the past two years, Elevate Cu 6370 has been in limited release and used in a wide variety of applications. With slight modifications to the electrolyte, Elevate Cu 6370 has been highly successful in tight RDL patterns, standard pillars, 200-micron tall mega pillars, bump on passivation structures, and other advanced packaging structures. The process is ideally suited for a variety of semiconductor advanced packaging platforms, including FOWLP (Fan-Out Wafer Level Packaging) Fan-In Wafer Level Packaging, and 2.5D/3D.