Technic to Present Advanced Packaging Solutions
at SEMICON Taiwan

 

Technic will be showcasing its latest innovations at SEMICON Taiwan 2025, the industry’s premier event for semiconductor manufacturing and advanced packaging technologies. Taking place September 10–12 at the Taipei Nangang Exhibition Center (TaiNEX 1 & 2), the exhibition provides a global platform for Technic to demonstrate how its advanced chemistries and process control solutions enable next-generation device performance.

At Booth N0029, Technic's Semiconductor Division will highlight: 

  • Elevate® electrodeposition chemistries engineered for RDL, copper pillar, microbump, and LED packaging applications.
  • High-performance TechniStrip®, TechniEtch, and Techniclean™ process chemistries that deliver superior reliability and yield.
  • The Technic RTA 3D, a state-of-the-art analytical control system providing unmatched process control for TSV and copper pillar applications.

With decades of expertise in metallization and process chemistry, Technic partners with leading foundries, OSATs, and equipment manufacturers worldwide. Its proven technologies support critical industry demands in advanced packaging, heterogeneous integration, and next-generation interconnects. 

SEMICON Taiwan 2025 will bring together over 1,200 exhibitors, 4,100 booths, and more than 100,000 industry professionals, spotlighting technologies that shape the future of microelectronics—from AI chips and 3DIC to silicon photonics and sustainable manufacturing. 

Technic invites attendees to visit Booth N0029 to connect with its experts and explore solutions that advance device performance, reliability, and efficiency across the global semiconductor supply chain.

Explore our Semiconductor Solutions

Register here