A workhorse process with the best harsh environment resistance, best wire bonding, excellent solderability, and lubricity. Technipad ENEPIG is the most robust process on the market.
TechniCatalyst AT4608 is a chloride-free, organo-metallic activator specifically designed to produce an immersion palladium deposit for the complete and uniform initiation of electroless nickel such as Techni EN AT 5600 or EN 5810 on Copper and Copper alloys.
Technic EN AT 5600 is an advanced, electroless nickel that produces a deposit with 6 – 9% w/w phosphorus. It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B and IPC4556. Unlike competitive processes, Technic EN AT 5600 provides better lateral growth on copper yielding better corrosion resistance and superior solderability. Technic EN AT 5600 process is uniquely formulated to minimize reaction by-product buildup and, as a result, this process has a dramatically longer bath life. Technic EN AT 5600 also features an advanced stabilizer system that provides excellent solution stability throughout the life of the solution, thus eliminating the need for “break-in” periods or minimum loading concerns.
Technic EN 5810 is an advanced, electroless nickel process that produces a deposit with 10 – 13% w/w phosphorus. It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets both IPC4552 and IPC4556. Unlike competitive processes, Technic EN 5810 provides better lateral growth on copper yielding better corrosion resistance, superior solderability, and low insertion loss for specific 5G applications. At 1/3 of the normal thickness for Nickel, it meets all the same corrosion specs, reduces the normal insertion loss for EN by half, and is more flexible. It produces a Non-magnetic deposit.
TechniPad 7611 is a stable, autocatalytic, electroless palladium plating solution. It is designed to deposit a pure palladium deposit on electroless nickel to improve solderability and provide a surface for both aluminum and gold wire bonding. TechniPad 7611 can be deposited directly on copper when the complete Technipad EPIG process is used. The TechniPad 7611 plating solution operates at a slightly acid pH and low temperature, which provides excellent compatibility with photo-imageable and UV-cured solder resist. The process provides excellent in-tank stability and meets IPC 4556.
TechniPad Au 6100 is a cyanide-based immersion gold plating process designed to provide a controlled deposition of thin pure gold deposits onto electroless nickel and electroless palladium. The gold deposition is controlled using proprietary additives which eliminates corrosion products on the nickel-gold interface that can form with PGC-based immersion gold. Elimination of these corrosion products provides a dramatic improvement in solderability over other processes. Deposits are uniform, fine-grained, and exhibit extremely low porosity. The solution has excellent pH buffering capacity and high tolerance to copper, nickel, and lead contamination. When used with the TechniPad ENIG or Technipad ENEPIG process, it is possible to operate at lower gold concentrations in the operating solution due to the flat electroless nickel deposit. An overall savings in gold consumption is possible if the entire TechniPad process is used.