Advanced Direct Metallization Processes

For Printed Circuit Boards, metalizing of die-electric material in through and blind vias is accomplished using electroless copper technology or processes know as direct metallization. Metallization has become more complicated by new material types and advanced features with an exponential increase in the volume of much smaller vias. This advancement in technology has pushed electroless chemistry to its limit. To meet this growing need for advanced metallization products, Technic has focused on direct metallization as it provides environmental, cost, and technical advantages over electroless copper.  The result of this focus is Technic’s Black Knight proprietary colloidal graphite process.

Graphite Cleaner Conditioner - Technic Circudept 3500

Circudep 3500

Circudep 3500 is a unique formulation providing excellent conditioning performance on a wide variety of substrates including polyimide, Rogers, FR-4, and high frequency, such as MPI, LCP, etc.

Advantages:

  • Mildly alkali cleaner with a high powered conditioning agent
  • Operates at a low-temperature, eliminating high power consumption and lengthy startup times.
  • Excellent cleaning properties eliminating oxidation and oils such as fingerprints from the copper surfaces.
  • Superb conditioning agent that provides uniform absorption of graphite particles.
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  • Excellent coverage and adhesion to Flex multilayer
    Excellent coverage and adhesion to Flex multilayer
  • Makes coverage of micro-blind vias possible
    Makes coverage of micro-blind vias possible
  • SEM blind via after Circudep 3500 System
    SEM blind via after Circudep 3500 System
  • Excellent coverage micro-through vias
    Excellent coverage micro-through vias
  • No post separation
    No post separation