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High Performance Metal Etchants for Semiconductor Packaging Applications
Metal etchants are used in semiconductor fabrication and packaging to chemically remove layers from the surface of a wafer during the manufacturing process. This hard mask removal is an essential part of device manufacturing, with each wafer undergoing multiple etching steps before completion.
Through its specialized TechniEtch product line, Technic offers a comprehensive range of etchants formulated for the diverse metals used in integrated circuits, optoelectronics, MEMS, and photovoltaic applications. Our products are designed to deliver controlled etch rates, uniformity, and excellent material compatibility across various process conditions.
As with all Technic products, we offer extensive experience and unparalleled customer service that have made Technic a trusted partner to leading semiconductor manufacturers worldwide.
Ti
TechniEtch TBR19, TBR38
The TechniEtch TBR series has been developed for selective Ti barrier removal in advanced UBM and Cu pillar integration materials. These Ti and TiN-based barrier etchants provide high Al and Cu compatibility.
Au
TechniEtch ACI2, ACI2WS
The TechniEtch AC series includes iodine-based solutions for Au patterning, offering stable etch rate, strong loading capability, and good wetting on Au surfaces.
Al
TechniEtch Al80, BAL220
This product line spans from acidic formulations that ensure fast, controlled etching to buffered alkaline chemistries that offer high anisotropy and selectivity toward Ni, Au, and Ti. Each formulation is engineered to meet the most demanding production standards.
Other TechniEtch Products
TechniEtch Cr01, CN10
Large range of wet etchants available upon request.
