ISIG - Autocatalytic Silver with Immersion Gold
Technicās ISIG process is a significant advancement over traditional immersion silver. It is the best conductive metal for 5G applications, performing exceptionally well up to 300 GHz. Unlike other processes, ISIG provide extremely gentle ion exchange with the copper and provides superior surface sealing, effectively preventing copper diffusion to the surfaceāa phenomenon known as creep corrosion. To further enhance protection, an immersion gold deposit can be applied, which shields the silver similarly to how it protects in ENIG processes. Immersion gold offers robust protection in harsh environments, especially in applications where solder mask is not used. It does match and surpass ENIG performance under creep corrosion testing.
Features
- Excellent RF properties
- Nickel-free
- Ideal for wire bonding and soldering
- Optimal for 5G spectrum
- Superior corrosion resistance
- Cost-effective
Benefits
- Enhanced reliability
- Simple operation
- Stable process
- AOI friendly
- Long life process
- Lowest signal lost process