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Post Etch Residue Cleaning for Wafer Level Surface Prep
Technic manufactures a variety of proprietary solutions for Post Etch Residue (PER) cleaning for wafer level surface preparation in semiconductor electronics applications. Our chemically safe cleaners have extremely high metal compatibility for a wide variety of substrates and can be used in combination with all types of production tools.
Customized Chemical Compositions Adaptable for Cleaning Virtually All Post-Etch Residues
Study of universally compatible post-etch residue cleaning formulations for traditional and high-k dielectric-based residues.
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TechniClean IK73
TechniClean IK73 is specially formulated to target the selective removal of highly-inert chemical residues created during the patterning of high-k dielectric metal oxides including hafnium, zirconium and tantalum oxides. TechniClean IK73 functions well at room temperature and is easily rinsed. The process is suitable in immersion, batch-spray, and single-wafer chemical applications.
TechniClean CA25
TechniClean CA25 is a semi-aqueous proprietary blend formulated to address post etch residue (PER) removal in pinched-through via and metal lines for all interconnect and technology nodes. This advanced residue cleaner offers a unique blend of ingredients that have been proven to be extremely efficient at quickly and selectively removing organo-metal oxides from the following materials: Al, Cu, Ti, TiN, W and Ni.
TechniClean CA25 has been designed to provide an optimum balance of surface wetting, reduced potential, chelating capacity and residue solubility to accomplish complete PER dissolution at a low temperature and short processing time for various electronic features such as lines, vias and pads.
