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Post Etch Residue Cleaners for Semiconductor Packaging Applications
Technic manufactures a variety of proprietary solutions for Post Etch Residue (PER) cleaning for wafer level surface preparation in semiconductor applications.
Our TechniClean product line is designed to penetrate and dissolve both organic and inorganic post-etch residues, while maintaining excellent compatibility with sensitive metals, dielectrics, and barrier layers. Each product is developed to meet the process integration requirements of advanced node manufacturing, providing superior surface preparation for subsequent deposition or patterning steps, and maintaining the integrity of critical features and structures.
With global technical support and rigorous quality control, Technic help fabs and tool manufacturers meet increasingly tight specifications and productivity targets.
TechniClean IK73
- Specially formulated to target the selective removal of highly inert chemical residues created during the patterning of high-k dielectric metal oxides, including hafnium, zirconium, and tantalum oxides.
- Works well at room temperature and is easily rinsed.
- Suitable for immersion, batch-spray, and single-wafer chemical applications.
TechniClean CA25
- Semi-aqueous proprietary blend formulated to address post-etch residue (PER) removal in pinched-through via and metal lines for all interconnect and technology nodes.
- Offers a unique blend of ingredients that have been proven to be extremely efficient at quickly and selectively removing organo-metal oxides from the following materials: Al, Cu, Ti, TiN, W and Ni.
- Provides an optimum balance of surface wetting, reduced potential, chelating capacity, and residue solubility to accomplish complete PER dissolution at a low temperature and in short processing time for electronic features such as lines, vias, and pads.
