Begin your search by selecting the Application, Process and Category or by specifying keyword(s)

Optional Filters

Process Results (1) Request More Information

TechniClean BOS390

Versatile cleaner developed to remove post-Bosch fluoropolymer residues and photoresist stripping.

Characteristics:
  • High-performance solution for TSV post-etch cleaning.
  • Capable of removing fluoropolymer layers left after Bosch DRIE, as well as stripping both P- and N-tone photoresists.
  • Offers a safer, non-fluorinated alternative to traditional fluoroether- or hydroxylamine-based chemistries, with excellent materials compatibility.
Availability: North America, Asia Pacific, Europe
Add
Finish Request