Skip to main content
  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • High Purity Chemistry
      • Equipment: Research & Development
        • SEMCON 1000
        • SEMCON Fountain
    • Components, Lead Frames, Connectors
      • ECLC Chemistry
        • Connectors
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • ECLC Equipment
    • Printed Circuit Boards
      • Chemistry
        • Final Finishes
          • ENIG & ENEPIG
        • Electrolytic Copper
        • Electrolytic Nickel & Precious Metals
        • Metallization
          • Graphite
        • Microetchants
      • Imaging Products
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post Treatment
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Solar
      • Deposition Chemistry
      • Plating Resist for Solar
      • Engineered Powder & Flake
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • 3D-Printing
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
      • Loose Parts Processing Systems
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Panels (MP100)
        • Cut Strip (Leadframes)
        • Finger Plater (FFP)
        • Single Piece (MP500)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Finishing Equipment Supplier
      • Advanced Engineered Systems
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Parts, Supplies & Accessories
      • Consoles, Work Stations, Hoods, Benches & Tables
      • Mazerustar Planetary Mixers
        • Demonstration Videos
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Products
    • Global Representatives
    • Equipment
      • Conductivity Test Apparatus
        • Tape Application Jig
    • Engineered Powders News
    • Safety Data Sheets (SDSs)
    • Daily Metal Prices
    • Conflict Minerals Report Request
    • ISO 9001:2015 Certification
    • Contact Us
  • Analytical Controls
    • Capabilities
      • Electroanalytical Methods
      • Data Analysis
      • Volumetric Analysis
    • Process Control Products
      • Real Time Analyzer (RTA)
        • RTA 3D
        • RTA Classic
        • ACE
        • SSF RTA 3D
        • PHD Option
      • EBA
        • EBA 3D
        • EBA 3D: Plus Option
        • EBA Classic
        • Technic Elevate Analyzer
      • Automatic Process Titrator
        • Maestro
        • NextChem Analyzer Support
    • Electrochemical Research Instrumentation
  • About
    • Contact Us
    • News & Events
      • Upcoming Trade Shows
      • Recent Trade Shows
    • Environmental Stewardship
    • Industry Partners
    • Conflict Minerals Reporting
    • Resources
      • Resource Library
      • Videos
      • Useful Tools
      • Daily Metal Prices
      • FAQ
    • Careers
      • Engineering Manager
      • Sales Support Associate
    • Global Facilities
      • EU Distributors
    • Technic SDS Access
Menu

Utility navigation

  • Select Region

Utility navigation - Region

  • North America
  • Europe
  • Asia Pacific
English English Deutsch Deutsch Chinese, Simplified Chinese, Simplified Korean Korean Japanese Japanese Chinese, Traditional Chinese, Traditional Italian Italian
English English Deutsch Deutsch Chinese, Simplified Chinese, Simplified Korean Korean Japanese Japanese Chinese, Traditional Chinese, Traditional Italian Italian
Home

Main navigation

  • Applications
  • Chemistry
  • Equipment
  • Engineered Powders
  • Analytical Controls
  • About
Copper plating chemistry for semiconductor applications on wafer.

Copper Electroplating Chemistry

Breadcrumb

  1. Home
  2. Semiconductor
Contact
Share Share
Print

Copper PlatingĀ for Advanced Semiconductor Packaging


As the semiconductor industry moves to more advanced packaging structures, the use of copper plating has continued to grow. Along with this growth, the requirements on the copper plating solutions and deposit have become more demanding. Technic’s ElevateĀ® Copper products are formulated to meet these demanding requirements such as high-speed plating, excellent coplanarity, and very low deposit roughness.

From very tight RDL (redistribution layer) patterns with 2 micron spaces, to 200 micron tall copper pillars, the Elevate® Copper processes can be adjusted to offer optimum results on a variety of semiconductor packaging platforms including FOWLP (Fan Out Wafer Level Packaging), Fan-In WLP (Fan-In Wafer Level Packaging), Flip Chip and 2.5D/3D.

All Elevate® Copper processes can be monitored with our industry leading Technic Elevate® Analyzer. In addition, we offer unparalleled customer service that has made Technic a respected resource for quality around the globe.

Copper Plating Bath, ElevateĀ® Cu 6370

ElevateĀ® Cu 6370

High-speed copper plating bathĀ able to achieve very fast plating rates on a variety of semiconductor applications while maintaining good WIW and WID coplanarity. 4 microns/minute or more can be attained on bump on passivation, bump on pad, and other advanced packaging structures while maintaining a WIW of <10% and a WID of <5%.Ā  Standard pillars, mega pillars, and RDLĀ structures can all be plated successfully with ElevateĀ® Cu 6370.Ā Ā 

Request more information
Copper semiconductor electroplating bath, ElevateĀ® 6340

Elevate® Cu 6340

A low-stress copper bath that can be used for any application that requires a low-stress deposit such as a glass substrate. Plates at 1 – 2 microns/minute with virtually no internal stress.

Ā 

Request more information

Applications

  • Semiconductor
    • Fabrication & Packaging Chemistry
      • Copper
      • Nickel & Tin
      • Precious Metals
      • Photoresist Strippers
      • Metal Etchants
      • Cleaners
    • High Purity Chemistry
    • Equipment: Research & Development
  • Components, Lead Frames, Connectors
  • Printed Circuit Boards
  • Industrial
  • Solar
  • Decorative
  • Medical
  • 3D-Printing
  • Application Support

Quick Tasks

  • Chemistry
  • Resource Library
  • Useful Tools
  • Industry Partners
  • Contact Us
Back to Top
Corporate Headquarters Technic Inc.
Tel:+1 401-781-6100
Technic Engineered Powders
Tel:+1 401-769-7000
Technic Equipment
Tel:+1 401-721-2300

Contact Us

Locations

  • North America
  • Europe
  • Asia Pacific

Site Footer Menu

  • Applications
    • Semiconductor
    • Components, Lead Frames, Connectors
    • Printed Circuit Boards
    • Industrial
    • Solar
    • Decorative
    • Medical
    • 3D-Printing
    • Application Support
  • Chemistry
  • Equipment
    • Automated Systems
    • Finishing Equipment Supplier
    • Manual Lines
    • Laboratory and R&D
    • Parts, Supplies & Accessories
    • Process
  • Engineered Powders
    • Products
    • Global Representatives
    • Equipment
    • Engineered Powders News
    • Safety Data Sheets (SDSs)
    • Daily Metal Prices
    • Conflict Minerals Report Request
    • ISO 9001:2015 Certification
    • Contact Us
  • Analytical Controls
    • Capabilities
    • Process Control Products
    • Electrochemical Research Instrumentation
  • About
    • Contact Us
    • News & Events
    • Environmental Stewardship
    • Industry Partners
    • Conflict Minerals Reporting
    • Resources
    • Careers
    • Global Facilities
    • Technic SDS Access

Technic Logo in white text

Ā© All Rights Reserved 2019

Footer menu

  • Privacy Policy
  • Legal Information

Follow us online Ā LinkedIn Ā Twitter Ā Facebook

  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • High Purity Chemistry
      • Equipment: Research & Development
        • SEMCON 1000
        • SEMCON Fountain
    • Components, Lead Frames, Connectors
      • ECLC Chemistry
        • Connectors
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • ECLC Equipment
    • Printed Circuit Boards
      • Chemistry
        • Final Finishes
          • ENIG & ENEPIG
        • Electrolytic Copper
        • Electrolytic Nickel & Precious Metals
        • Metallization
          • Graphite
        • Microetchants
      • Imaging Products
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post Treatment
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Solar
      • Deposition Chemistry
      • Plating Resist for Solar
      • Engineered Powder & Flake
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • 3D-Printing
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
      • Loose Parts Processing Systems
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Panels (MP100)
        • Cut Strip (Leadframes)
        • Finger Plater (FFP)
        • Single Piece (MP500)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Finishing Equipment Supplier
      • Advanced Engineered Systems
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Parts, Supplies & Accessories
      • Consoles, Work Stations, Hoods, Benches & Tables
      • Mazerustar Planetary Mixers
        • Demonstration Videos
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Products
    • Global Representatives
    • Equipment
      • Conductivity Test Apparatus
        • Tape Application Jig
    • Engineered Powders News
    • Safety Data Sheets (SDSs)
    • Daily Metal Prices
    • Conflict Minerals Report Request
    • ISO 9001:2015 Certification
    • Contact Us
  • Analytical Controls
    • Capabilities
      • Electroanalytical Methods
      • Data Analysis
      • Volumetric Analysis
    • Process Control Products
      • Real Time Analyzer (RTA)
        • RTA 3D
        • RTA Classic
        • ACE
        • SSF RTA 3D
        • PHD Option
      • EBA
        • EBA 3D
        • EBA 3D: Plus Option
        • EBA Classic
        • Technic Elevate Analyzer
      • Automatic Process Titrator
        • Maestro
        • NextChem Analyzer Support
    • Electrochemical Research Instrumentation
  • About
    • Contact Us
    • News & Events
      • Upcoming Trade Shows
      • Recent Trade Shows
    • Environmental Stewardship
    • Industry Partners
    • Conflict Minerals Reporting
    • Resources
      • Resource Library
      • Videos
      • Useful Tools
      • Daily Metal Prices
      • FAQ
    • Careers
      • Engineering Manager
      • Sales Support Associate
    • Global Facilities
      • EU Distributors
    • Technic SDS Access