Visit Technic at SEMICON Korea 2026

Technic to Exhibit Advanced Semiconductor Chemistries at SEMICON Korea 2026 

Technic will be participating in SEMICON Korea 2026, taking place February 11–13 at COEX in Seoul. Visit booth #C347 to meet the Technic team and learn more about the company’s latest innovations throughout the three-day event.

At this year’s exhibition, Technic will present its comprehensive portfolio of chemistries for advanced semiconductor packaging. This includes the company’s well-recognized Elevate® electrodeposition technologies, engineered for high performance in applications such as redistribution layers (RDL), pillars, microbumps, and LED packaging. With solutions for Cu, Ni, Sn, Au, Au/Sn, and In, Elevate® processes are designed to deliver exceptional uniformity, precision, and reliability across today’s most demanding device architectures.

In addition to its electrodeposition technologies, Technic will highlight its broad range of high-performance chemistries for a variety of substrates used in wafer level surface preparation. These include the TechniClean® line for PER removal, post-CMP cleaning, ink removal, and debonding; TechniStrip® liquid and dry film photoresist stripping technologies; and TechniEtch® selective etchants designed for barrier, seed layer, and stack metal removal. Together, these technologies provide manufacturers with integrated solutions that enhance yield, improve device performance, and maintain consistent process control.

Visit Technic at booth #C347 to learn how its advanced chemical solutions enable tighter process windows, improved yield, and reliable performance in advanced semiconductor packaging and manufacturing.