Technic to Showcase Semiconductor Solutions at SEMICON Europa 2025


Technic will participate in SEMICON Europa, taking place November 18–21, 2025, in Munich, Germany. 

Co-located with Productronica, SEMICON Europa is Europe’s premier event for the semiconductor and microelectronics industries, bringing together global innovators, manufacturers, and suppliers across the entire electronics supply chain.

Technic supplies some of the industry's most advanced solutions for semiconductor fabrication and packaging. The company’s portfolio includes next-generation chemistries, as well as precision plating systems designed to meet the demands of advanced packaging, IC substrates, power devices, MEMS, and wafer-level applications.

Technic's Elevate® processes offer high-performance electroplating for copper, nickel, tin and precious metals. The latest additions to this expanding product line, Elevate Cu 3000 and Elevate Cu 1500, have been developed for 2.5D and 3D integration, supporting the high-density interconnects essential to AI and other next-generation semiconductor applications. Elevate Cu 3000 offers flexible feature profiles and excellent coplanarity across a wide current density range, while Elevate Cu 1500 provides outstanding via-fill capability and surface leveling for high-reliability interconnects.

With decades of expertise in wet processes, Technic provides advanced photoresist strippers, metal etchants, and cleaning solutions—each engineered for precise material removal and surface conditioning, without compromising device integrity. Through ongoing R&D and collaborative projects, Technic is constantly developing safer, more sustainable chemistries that reduce environmental impact and support next-generation manufacturing standards.

Visit booth #B1441 to explore our latest electroplating chemistries, surface preparation solutions, and technical innovations designed to enhance semiconductor performance and reliability.
 

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