Pawtucket, RI, USA – Technic has announced the newest addition to its SEMCON® line of equipment for wafer-level deposition. The Semcon Fountain is the latest development in the highly successful series of wafer plating tools by Technic. Expanding on the popularity of the Semcon 1000 for single wafer R&D processing and small-scale production, the Semcon Fountain offers additional options and features. One significant feature is a chamber design with a solution sparger that more closely resembles a full-scale production tool. The Semcon Fountain’s unique design orients the wafer in a more favorable horizontal position, mimicking most of the semiconductor mass production electroplating tools.
The Semcon Fountain is capable of processing wafers up to 300 mm and utilizes a variety of wafer “cups” for different size wafers. The Semcon Fountain can achieve optimum processing for each application by adjusting the sparger, solution flow, and shielding. Each diameter-different cup allows for maximum tool flexibility by being able to run different wafer sizes using a single plating cell, making it extremely versatile and economical. The Semcon Fountain is ideal when setting up an electroplating process for the first time, or when introducing a new metal plating bath to an already existing electroplating process.
We could not be happier with the performance and versatility of the Semcon Fountain. We are currently operating in several locations including our R&D labs in Asia and the US for customer evaluations. The Semcon Fountain has performed with excellent results on a variety of substrates including Si, GaAs, InP, and others.
Technic Global Product Manager for Semiconductor Technology