Technic Presents Paper at SMTA on Improving Silver Performance in 5G Applications
Eric Stafstrom, Technic Global Products Manager
Denis Jacques, Technic Director of PCB Services
Technic's paper covers three topics. First, why immersion silver is a great choice as a final finish for 5G millimeter-wave applications. Secondly, a review of the failure mechanisms for issues like creep corrosion and champagne voids with initial formulas. And finally, how through the use of a novel slightly alkaline nitrate-free formula, the paper offers a solution to eliminate the main cause for these issues, porosity and aggressive copper attack of the original formulas.
Test data provided demonstrate how a thin pore-free silver deposit is robust enough to withstand harsh corrosive environments. The paper documents three industry-specific tests: nitric acid dip for porosity, multiple passes through OSP pre-clean to compare chemical resistance, and exposure to the high sulfur atmosphere to measure protection in a corrosive environment. In all cases, the nitrate-free formula outperformed the original formulas.
Denis Jacques, Technic Director of PCB Services will be presenting the paper on November 4, 2021, at the SMTA Conference held in Minneapolis, Minnesota, USA.
SMTA International remains an exceptional event, attracting an outstanding group of authors, speakers, and exhibitors. SMTA’s technical program offers papers and presentations from true subject matter experts covering a wide range of electronic manufacturing topics. SMTA International consistently welcomes over 100 speakers into the technical program each year, along with offering professional development courses and student poster sessions.