Boric Acid Free Nickel Plating with Elevate® Ni 5950
Exceptionally Stable and Versatile, Sulfamate Plating
Watch our recorded webinar to learn how Elevate® Ni 5950 eliminates concerns around boric acid toxicity while addressing low water solubility, making it the ideal choice for wafer fabrication.
Traditional nickel plating solutions utilize boric acid as a buffering agent. New regulations and guidelines identify boric acid as problem in two essential areas:
Toxicity: Boric acid is classified as a toxin for reproduction (May impair fertility or cause harm to an unborn child.)
Low Water Solubility: Boric acid concentration in a nickel solution is typically 40 g/l. Because of boric acid’s low solubility in water, an effective liquid replenisher can be challenging. Additions have to be made by dissolving boric acid powder in heated water before adding it to the tank. This method has caused incomplete dissolution of the boric acid resulting in redeposit on the wafers.
Technic Elevate® Ni 5950 eliminates both of these problems by being boric acid free and by being comprised of all liquid components, thereby eliminating any solubility issues. Elevate® Ni 5950 produces nickel deposits equal to or better than deposits utilizing boric acid.