Proprietary Additive Eliminates Nickel Replacement Reaction; Provides Tighter Control of Gold Deposit
Cranston, RI, USA - Technic has announced the release of Techni IM Gold AT6100, representing a paradigm shift in immersion gold plating. In the typical ENIG process, immersion gold is a replacement reaction, whereby Ni is removed or corroded from a substrate and replaced with gold. During this process, complications like black pad or hyper corrosion can occur if the corrosion becomes too aggressive, creating a surface that can be difficult to solder. Technic’s Techni IM Gold AT6100 has a proprietary additive that makes it possible to deposit gold without removal of nickel. This unique additive eliminates almost all of the replacement reaction and corrosion that occurs with a typical immersion gold process.
The primary mechanism in Techni IM Gold AT6100 utilizes the Ni as a site for gold reduction but does not remove it from the surface. The additive is not conventional. The reaction stops once the Ni is coated, creating a pore-free surface that allows for a tighter and more controlled deposit.
The Techni IM Gold AT6100 deposit is just as revolutionary as the process itself. The deposit has shown a significant improvement in solderability since there is no corrosion of the underlying nickel layer. Techni IM Gold AT6100 has also shown reductions in gold usage by 10-20% through longer bath life and a tighter gold distribution. Techni IM Gold AT6100 transcends a typical immersion gold by providing better results while reducing process costs.