Technic's Elevate® Copper Solutions for Advanced Semiconductor Packaging

 

This webinar explores Technic’s Elevate® copper plating processes designed for advanced semiconductor packaging, with a focus on 2.5D and 3D structures that are driving the growth of AI and next-generation technologies.

As AI pushes the boundaries of speed, energy efficiency, and computational density, semiconductor packaging plays a pivotal role. 

Learn how Technic’s copper solutions deliver the reliability, flexibility, and precision required to meet these evolving demands.

 

Products Featured

  • Elevate® Cu 3000 – A versatile three-component copper process for RDLs, pillars, and other advanced packaging features.

  • Elevate® Cu 1500 – A two-component MSA copper process engineered for high-performance TSV plating.

Benefits of Technic’s Elevate® Copper Processes

  • Optimized for 2.5D and 3D advanced packaging applications.

  • Reliable via fill, pillar, and RDL plating performance.

  • Predictable, stable additive packages for simplified process control.

  • High versatility across feature sizes and shapes.

  • Proven success in global semiconductor manufacturing environments.

Discover how Technic’s Elevate® Cu 1500 and Cu 3000 are shaping the future of AI-driven semiconductor technologies.

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