Elevate® Copper Solutions for Advanced Packaging

 

This webinar highlights Technic’s Elevate® Cu 1500 and Cu 3000, engineered to meet the demands of next-generation 2.5D and 3D semiconductor packaging.

Focusing on the needs of AI-driven technologies, it shows how these cutting-edge copper processes deliver precision, versatility, and reliability for critical features such as TSVs, RDLs, and copper pillars.

External Resource

Watch Now