How the SBE Chamber Works

Advantages in Performance and Maintenance

Technic SBE Head
SBE Chamber and Inset

The SBE® plating chamber features a proprietary design that rapidly circulates parts over the cathode current feeder without any mechanical movement. Parts are carried through the chamber by high-speed plating solution flow—up to 60 liters per minute—ensuring they are always exposed to fresh solution, regardless of their size or shape.

This continuous, high-flow circulation results in:

  • Superior part-to-part thickness uniformity

  • Significantly reduced part coupling and clustering

SBE DiagramThanks to its tighter thickness distribution, the SBE® system allows SMT manufacturers to plate parts much closer to the minimum required thickness, reducing metal usage and increasing process efficiency compared to traditional barrel plating systems.

Additional Advantages:

  • Faster production speeds while maintaining strict quality standards

  • Reduced maintenance: Unlike barrels, the SBE® screens are located in non-plating zones, eliminating unwanted tin or nickel buildup on the screens and simplifying chamber cleaning

The SBE® is not just a plating system—it's a proprietary breakthrough in precision, efficiency, and reliability for high-performance electronic component finishing.