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Technic Solar Chemistry

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Technic Solar Solutions

While Technic continues to provide the highest quality, finely engineered powders and flakes for solar applications, we also provide several electroplating solutions specifically formulated to form plated metal contacts on solar cells. Our electroplating solutions for solar cell manufacturing, marketed under the name TechniSol®, are silver-free, offering a lower cost option with excellent efficiency results.

Advantages of Electroplated Contacts with TechniSol®

Plated contacts in solar cell manufacturing can achieve several key advantages over silver paste contacts:

  • <40-micron grid lines
  • 50% lower gridline contact resistance
  • Twice the grid line conductivity
  • 25% or more cost reduction
  • Higher pull-strengths resulting in better adhesion
  • Repeatable cross-sectional shape when compared to double-print grid line
  • A minimum of 0.5% increase in efficiency

Technic’s TechniSol® plating chemistries can be used for standard front side contact cells and also for advanced cell structures such as bifacial and heterojunction.

Downloadable Files

Technic TechniSol Process Chemistry
Solar Cell Inspection

TechniSol® Nickel 2428

  • Novel Boric Acid-Free Nickel Chemistry developed to plate Ni on silicon solar cells using LIP with or without rectification.
     
  • This chemistry is very stable and requires little maintenance.
     
  • Nickel deposited from this bath has low stress and good diffusion barrier properties. Solar cells plated with this chemistry show similar electrical performance and peel test performance (good adhesion) to silver paste controls.
Learn More
Solar cells

TechniSol® Cu 3000

  • Produces low-stress deposits which meet the stringent requirements of the photovoltaic industry.
     
  • High plating rates of 3 – 5 microns/minute with good coplanarity
     
  • Wide process window and a stable additive package
     
  • Can be used with Light Induced Plating or electrolytic plating
     
  • All components are easily analyzed with the Technic EBA (Electroplating Bath Analyzer)
     
  • Can be used to plate standard front-side contact cells with Al BSF, PERC, bifacial cells, HJT and most other cell types.
Learn More
LIP Module

TechniSol® Sn 2480

  • Unlike traditional tin plating solutions, this chemistry stays clear throughout the life of the bath making it ideal for LIP.  It can also be used for standard electroplating.
     
  • Offers excellent solderability during module assembly.
     
  • Uses a single additive for replenishment which produces tin deposits with extremely low organic levels.
Learn More

Downloadable Files

Light Induced Plating of Silicon Solar Cells Using Boric Acid-Free Nickel Chemistry
Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process
Compatibility of ASL process with Mono-Si & Poly-Si substrates patterned by laser or wet etching
Formation of a low Ohmic contact nickel silicide layer on textured silicon wafers using electroless nickel plating

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  • Applications
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        • Semcon 2000
        • Semcon 2500
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    • Components, Lead Frames, Connectors
      • Electronic Component Chemistry
        • Connectors
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • Electronic Component Finishing Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Masks, Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
      • Imaging Products
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Solar
      • Deposition Chemistry
      • Plating Resist for Solar
      • Engineered Powder & Flake
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
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        • Cataphoretic Lacquers
        • Color Treatments
      • Post-Treatment
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    • Medical
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      • Chemistry
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      • Application Guides
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  • Chemistry
  • Equipment
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        • Cantilever/Sidearm
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        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Anodizing Equipment
      • Anodizing Mini-Plant
      • Apex Modular Anodizing Equipment
      • Custom Anodizing Equipment
      • Titanium Anodizing Equipment
      • Anodizing Resources
        • What Anodizing System if right for me.
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        • Demonstration Videos
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      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Products
    • Global Representatives
    • Equipment
      • Conductivity Test Apparatus
        • Tape Application Jig
    • Engineered Powders News
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    • Conflict Minerals Report Request
    • ISO 9001:2015 Certification
    • Contact Us
  • Analytical Controls
    • Capabilities
      • Electroanalytical Methods
      • Data Analysis
      • Volumetric Analysis
    • Process Control Products
      • Real Time Analyzer (RTA)
        • RTA 3D
        • RTA Classic
        • ACE
        • SSF RTA 3D
        • PHD Option
      • EBA
        • EBA 3D
        • EBA 3D: Plus Option
        • EBA Classic
        • Technic Elevate Analyzer
      • Automatic Process Titrator
        • Maestro
        • NextChem Analyzer Support
    • Electrochemical Research Instrumentation
  • About
    • Contact Us
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      • R&D Powder Scientist
      • Senior Key Account Manager – Specialty Chemical Semiconductor (Europe)
      • Electrical Controls Hardware Designer
      • Sales Support Associate
    • Global Facilities
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