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Industry-Leading Photoimageable Solder Mask Series
Our LDI and UV compatible photoimagable inks, either epoxy or polyimide based, are ideal for creating intricate PWB circuit patterns with precision, particularly for flex circuit production.
The TechniFlex LCL 1000F series of photoimageable solder masks offer a combination of flexibility, extreme dimensional accuracy, and high thermal resistance that is unmatched in the flex circuit industry.
TechniFlex LCL 1000F/421M is available in three versions:
- TechniFlex LCL 1000F/421M U6 - for direct imaging/manual exposure
- TechniFlex LCL 1000F/423M U7 series - for either direct imaging/manual exposure or roll to roll coating operations
- TechniFlex LCL 1000F/421M U8 - next generation black direct image high heat resistance flexible solder mask
TechniFlex LCL 1000F/421M U8
TechniFlex LCL 1000F/421M U8 is a liquid photo-definable halogen-free flexible black matte solder mask. This product is specially designed for low exposure energy, with recently available high output direct imaging systems.
- No cracking after multiple 180 degree bends, even when processing 12-micron polyimide substrate.
- RoHS compliant and free from bisphenol A, halogen, Sb, Be and phthalate.
- High resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes.
- Less than 10 microns of undercut.
