Resist Strippers for Advanced Packaging Applications
Technic offers a number of Photoresist Strippers, each with specialized characteristics and benefits, for use in semiconductor fabrication and packaging. Technic's line of TechniStrip® products provide superior results and consistently high performance with the highest standards of purity. As with all Technic products, we offer our extensive experience and unparalleled customer service that has made Technic a respected resource for quality around the globe.
A highly effective negative tone photoresist remover used mainly for TSV mask and solder bumping applications. Developed to address laminated photo-resins and liquid resins, the novel stripping formulation of this TMAH/DMSO chemistry exhibits high dissolution performance compared to standard TMAH based blends.
TechniStrip® NF52 provides full dissolution of most photoresist without the use of harmful products such as NMP and Hydroxylamine. NF52 successfully performs without any negative impact to the copper surface, preserving critical fine features that would otherwise be negatively impacted by photoresist strippers that can etch into fine surface details.
TechniStrip® NF52 is a highly effective photoresist remover and is compatible with numerous substrates. TechniStrip® NF52 has been documented to perform with an extended bath life that is typically 2–3 times greater than standard photoresist strippers, resulting in a significant savings in operating costs.
An advanced photoresist stripper that has a wide range of applications from DUV to thick negative resins and passivation layer reworking. It is especially ideal for use in back end applications like TSV, Cu pillar, bumping, etc. Offers complete resin dissolution of thick film photoresist such as THB151N, THB121N, AZ125XT, etc.
Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXt, AZ40XT and AZnLOF 2000 series. High metal compatibility from a DMSO and TMAH free solution.
TechniStrip® MLO 07
TechniStrip® MLO-07 is a highly effective negative & positive photoresist remover used for TSV mask, solder bumping, hard disk stripping and metal lift off applications. Developed to address high dissolution performance and high material compatibility such as Cu, Al, Sn/Ag, Alumina, magnetic alloys, etc. TechniStrip® MLO-07 advantages are its process versatility, longer bath life and safer alternative compared to standard TMAH based blends.