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High Performing Photoresist Removers for Semiconductor Packaging Applications
Technic provides a range of photoresist strippers for residue removal, each formulated with specific properties and advantages to meet the demands of semiconductor fabrication and packaging.
Technic's line of TechniStrip® products for surface preparation and resist stripping provide superior results and consistently high performance with the highest standards of purity. TechniStrip® photoresist removers are environmentally friendly, NMP-free, and include no hydroxamine or harsh chemicals.
With global technical support and rigorous quality control, Technic help fabs and tool manufacturers meet increasingly tight specifications and productivity targets.
TechniStrip® NF52
- Highly effective NMP-free negative tone photoresist remover, mainly used for TSV mask and solder bumping applications.
- Developed to address laminated photo-resins and liquid resins, this novel TMAH/DMSO chemistry exhibits high dissolution performance vs standard TMAH-based blends.
- Its stripping performance has been validated on various laminated films including WBR2010, WBR2100, TOK P50120, etc.
- Offers an extended bath life that is typically 2–3 times greater than standard photoresist strippers, resulting in significant savings in operating costs.
TechniStrip® P1331
- Advanced NMP-free photoresist stripper that has a wide range of stripping applications from DUV to thick positive, negative resins and passivation layer reworking.
- Ideal for use in back end applications like TSV, Cu pillar, bumping.
- Offers complete resin dissolution of thick film photoresist such as THB 151N, AZ 125XT, OIR 906, SPR 3000, TOK, while maintaining a very high metal compatibility with Cu, Al, Ni, and Sn.
TechniStrip® MLO07
- Highly effective negative & positive photoresist remover used for TSV mask, solder bumping, hard disk stripping and metal lift off applications.
- Developed to address high dissolution performance and high material compatibility such as Cu, Al, Sn/Ag, Alumina, magnetic alloys, etc.
- Key product advantages are process versatility, longer bath life and safer formulation, compared to standard TMAH-based blends.
TechniStrip® Micro NGA II
- Organic-based resist stripper dedicated to achieving fast, complete resin dissolution and/or lift-off of resilient organic films such as rubber-like resin (SC 180, SC420), epoxy, grease, and backlap wax.
- NGA II does not contain mono and poly hydroxy benzene, such as catechol, phenol, chlorinated, and/or naphthalene-based solvents.
TechniStrip® Micro D2
NMP-free
- Organic mixture designed to address selective resist stripping and negative tone development with high metal compatibility.
- This lower-cost, NMP replacement solution can effectively strip positive resin off with total compatibility on III/V substrate such as GaAs.
