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High Performing Photoresist Removers for Semiconductor Packaging Applications
Technic provides a range of photoresist strippers for residue removal, each formulated with specific properties and advantages to meet the demands of semiconductor fabrication and packaging.
Technic's line of TechniStrip® products for surface preparation and resist stripping provide superior results and consistently high performance with the highest standards of purity. TechniStrip® photoresist removers are environmentally friendly, NMP-free, and include no hydroxamine or harsh chemicals.
With global technical support and rigorous quality control, Technic help fabs and tool manufacturers meet increasingly tight specifications and productivity targets.
TechniStrip® NF series
TechniStrip® NF52, NF26, NF90
DMSO-based strippers for full dissolution of P- and N- tone and laminated photoresists, with excellent metals compatibility. TMAH-free version available.
TechniStrip® P13 series
TechniStrip® P1331
DMSO/water-based strippers for liquid photoresists, including highly cross-linked films, while ensuring compatibility with most metals.
TechniStrip® MLO series
TechniStrip® MLO07, MLO02
Highly effective strippers for P-tone photoresist, BARC dissolution, metal lift-off.
TechniStrip® Micro NGA series
TechniStrip® Micro NGAII, Micro NGA883
Organic solutions for the removal of rubber-like resins, BCB, and organic materials. Petroleum-free version available.
TechniStrip® NI series
TechniStrip® NI555, NI777, NI789
Unique acidic strippers for full dissolution of chemically amplified resins, such as AZ15nXT and nLOF resins.
100% solvent series
TechniStrip® 680, Micro D350, Micro D2, DB12
100% solvent-based NMP alternatives, engineered for efficient photoresist stripping and lift-off processes.
