SEMCON® Semiconductor Electroplating Tools
Technic offers a full range of semiconductor electroplating tools including laboratory and small-scale production plating technologies for electroplating applications and fully automated production equipment for electroless processes such and ENIG and ENEPIG. From single-cell countertop testing devices to fully enclosed automatic rack transport systems with multi programmable functions, Technic has the right SEMCON tool for your operation.
SEMCON 1000 Wafer Plating Tool
Designed and developed specifically for research and low volume production, the Semcon 1000 has become an essential tool for wafer electrodeposition evaluation and application performance testing.
SEMCON Fountain Wafer Plating Tool
Expanding on the popularity of the Semcon 1000 single wafer processing for R&D and small scale production, the Semcon Fountain offers more options and features with a patented chamber design and solution sparger that closely resembles a full-scale production environment.
The Semcon 2000 is a highly dependable, wet bench style, multiprocessing, electroplating tool that performs critical plating accuracy with a high degree of uniformity and repeatability.
The Semcon 2500 is an automatic, fully enclosed, multi-wafer rack system designed for use with electroless and immersion plating processes such as ENIG and ENEPIG. This modular system utilizes a programmable multi-process interface and offers easy access for maintenance/changeovers, making it ideal for both process development and full-scale production.
Wafer Plating Test Cell
Technic’s Wafer Test Cell provides a complete, portable environment for wafer plating. The unit is designed for laboratory research and small-scale production testing and sampling of plated wafers.