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Sulfite gold plating for advanced semiconductor applications

Semiconductor Sulfite Gold Plating Chemistry

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Non-Cyanide, Gold Wafer Plating Process for Advanced Semiconductor Applications

 

sulfite gold plating for advanced semiconductor applications

Elevate® Gold 7990 NBV HT

Technic's industry-leading Elevate® Gold 7990 NBV HT is a cyanide-free, electrolytic sulfite gold process designed specifically for semiconductor applications. The process produces pure, soft bright gold deposits from a slightly acidic solution without the use of harmful toxic metallic grain refiners such as thallium and arsenic.  

Key Features & Benefits


Versatility: Elevate® Gold 7990 NBV HT has become the process of choice in a wide range of industry applications including, but not limited to RDL, blanket deposits, pattern plating, conformal via plating, and thick gold bumping. The process can be used for plating several different applications without major modifications to the solution and can be used on a variety of different tool sets.  

  • Thickness ranging from <1 to 100 microns
  • Extremely compatible with almost all photoresist
  • Process of choice for a wide range of applications

Stability: While typical sulfite gold baths run at a pH of approximately 9.0, Technic's proprietary stabilizer allows for maximum bath stability with an atypical, slightly acidic, optimum pH of 6.6. The low pH provides the following benefits:

  • Bright deposits without the use of toxic metallic grain refiners
  • Smooth grain structure
  • Excellent step coverage
  • Extended bath life

 

Availability: North America, Asia Pacific, Europe

Request More Info
  • Stable gold plating for advanced semiconductor applications; Elevate Gold 7990 NBV HTdemonstrates slightly acidic pH
    Stable gold plating for advanced semiconductor applications; Elevate Gold 7990 NBV HTdemonstrates slightly acidic pH
  • Gold Plating for Advanced semiconductor application
    Gold Plating for Advanced semiconductor application
  • Stable gold plating bath free of arsenic, thallium, other harsh grain refiners
    Stable gold plating bath free of arsenic, thallium, other harsh grain refiners
  • Semiconductor gold plating - Electrolytic gold plating with Elevate Gold 7990 NBV HT
    Semiconductor gold plating - Electrolytic gold plating with Elevate Gold 7990 NBV HT
  • Cyanide Free Semiconductor Gold Plating with Elevate Gold 7990 NBV HT: Good sidewall and bottom via plating
    Cyanide Free Semiconductor Gold Plating with Elevate Gold 7990 NBV HT: Good sidewall and bottom via plating
  • Non-Cyanide Semiconductor Gold Plating with Elevate Gold 7990 NBV HT: 30 microns of gold with no plating under photoresist
    Non-Cyanide Semiconductor Gold Plating with Elevate Gold 7990 NBV HT: 30 microns of gold with no plating under photoresist
  • Sulfite Gold Plating with Elevate Gold 7990 NBV HT: 7 microns thickness demonstrating excellent pattern retention
    Sulfite Gold Plating with Elevate Gold 7990 NBV HT: 7 microns thickness demonstrating excellent pattern retention

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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Analytical Control (RTA)
      • Equipment: Research & Development
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
        • Semcon Wafer Racks
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • ECLC Chemistry
        • Connectors
          • - Precious Metals
          • - Non-precious Metals
          • - Post-Treatment
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • ECLC Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
        • - ASIG
      • Imaging Products
        • Photoimageable Materials
          • - TechniFlex LCL
        • IRP Thermosetting Inks
        • Conductive Silver Paste
        • LED Inks
        • Peelable Masks
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Solar
      • Energy Technologies
        • Hydrogen Technology
      • Engineered Powder & Flake
    • Technic ECO Products
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
          • - How it works
          • - Configurations
          • - Automation
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Anodizing Equipment
      • Anodizing Mini-Plant
      • Apex Modular Anodizing Equipment
      • Custom Anodizing Equipment
      • Titanium Anodizing Equipment
      • Anodizing Resources
        • What Anodizing System if right for me.
    • Parts, Supplies & Accessories
      • Consoles, Work Stations, Hoods, Benches & Tables
      • Mazerustar Planetary Mixers
        • Demonstration Videos
      • Equipment Support
        • Finishing Equipment Supplier
          • Advanced Engineered Systems
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Products
    • Global Offices & Distributors
    • Equipment
      • Conductivity Test Apparatus
        • Tape Application Jig
    • Safety Data Sheets (SDSs)
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    • Contact Us
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      • Electroanalytical Methods
      • Data Analysis
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    • Process Control Products
      • Real Time Analyzer (RTA)
        • RTA 3D
        • RTA Classic
        • ACE
        • SSF RTA 3D
        • PHD Option
      • EBA
        • EBA 3D
        • EBA 3D: Plus Option
        • EBA Classic
        • Technic Elevate Analyzer
      • Automatic Process Titrator
        • Maestro
        • NextChem Analyzer Support
    • Electrochemical Research Instrumentation
  • About
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