A Discussion of Industry Trends and New Products with Our Technical Experts
Join our team of experts as they discuss the current trends, challenges, and solutions for today's manufacturing. The webinars listed below are recorded live with a question and answer session after each presentation.
Our recorded webinars are available to registered users.
Final Finishes for 5G Printed Circuit
Preparing for the Future
As 5G implementation rolls out, the demand for greater speeds and higher frequencies brings significant challenges for PCB manufacturing. Our webinar will explain the technology behind these challenges and try to present a clear understanding of what the current range of final finishes has to offer fabricators, assemblers, and OEM Designers.
Elevate Gold 7990 NBV
Sulfite Gold Plating Process
The Elevate® Gold 7990 NBV process produces pure, soft gold deposits while operating at a slightly acidic pH, making it compatible with almost all photoresists. It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. The process provides excellent coplanarity and step coverage and can be used in several different plating applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution, and on a variety of toolsets.
Technibrite HT 1000
New Bright Acid Tin Process
Two Sessions Available: English and German
Technibrite HT 1000 process has an exceptional low current density bright range, even when the plating bath temperature and tin concentration parameters are higher than normal. The process can run without a chiller or at temperatures as high as 35˚C, and with tin concentrations as high as 60 g/l. Cathode efficiencies of up to 90% are achievable for Technibrite where the industry standard of leading competitors is only 60—70%. Cycle times can also be significantly reduced thereby increasing the productivity of the plating line by as much as 50%.
Techni Buffer IG
Boron-Free, Liquid pH Buffer for Nickel Electroplating
Three Sessions Available: English, Italian, and German
Techni Buffer IG, a new boron-free pH buffer for nickel plating applications. The demand for boron-free products is steadily growing, especially in Europe, where boric acid has been included in the SVHC list as a dangerous, reprotoxic substance. Techni Buffer IG, designed for both general metal finishing and decorative applications, has been developed to address the growing demand for a boron-free, high-performance nickel process.