New High Throw, Low Cost Tin Process for Improving Yields of Advanced PCB Designs
Cranston, RI, USA - Technic has announced the release of Technistan HTM 4089, a High Throw Matt (HTM) tin sulfate process engineered to increase yields in advanced printed circuit boards. The Technistan HTM 4089 additive suppresses deposit thickness on the surface creating a thicker deposit in the center of a high aspect ratio through hole or at the bottom of a blind microvia with a highly consistent, fine grain deposit. This deposit along with its excellent throw provides exceptional resistance to final etchants. In addition, all the components of Technistan HTM 4089 are fully analyzable and extremely stable, resulting in a cost effective solution for improving yields of advanced PCB designs.