Resolving Stripping, Etching, and Cleaning Challenges for Shrinking Dimensions in Advanced Packaging
Taiwan, China - A presentation titled Current Stripping, Etching, and Cleaning Challenges in Advanced Packaging by Technic’s Technology and Innovation Director, Dr. Jerome Daviot was held at Semicon Taiwan on September 13, 2017.
Dr. Daviot’s presentation addressed the acceleration of advanced packaging developments to meet current semiconductor system requirements and the considerable stress this places on current manufacturing methods. The presentation focused on BEOL and FBEOL residue removal, photoresist stripping, and metal etching, and the new classes of specialty chemical processes that will be required to address the smaller dimensions and complexity in semiconductor manufacturing.
The presentation went on to cover semiconductor advances in specific areas of compatibility, selectivity, full dissolution of photoresists (P/R), and reductions in overall CoO to enable this wave of next-generation packaging. Dr. Daviot’s presentation included new technology in highly selective wet metal etchants, full dissolution P/R stripping of thick resists, and advanced surface cleaning for high k dielectrics.
Technic has been a leading innovator in meeting the challenges of today’s advanced packaging trends with highly effective solutions for stripping, etching, and cleaning in the semiconductor industry.
Technic has been able to offer a number of products that have been extremely successful in addressing the most current needs of the industry. Our TechniEtch, TechniStrip®, and TechniClean families of products are well respected for their effectiveness in meeting some of the most challenging production concerns in advanced packaging.
- Dr. Jerome Daviot, Technology & Innovation Director