Technic will be presenting a technical paper on the Selective Removal of Post-Etch Residues Formed by Patterning of High-K Materials Through Precise Control of Water During Cleaning at the Business of Cleans and Surface Preparation and Cleaning Conference (SPCC) held April, 9-11 at the Royal Sonesta Hotel, Cambridge, MA.
The paper is a collaboration between Technic, STMicroelectronics, and CEA-Leti and will be presented by Technic’s Technology and Innovation Director, Dr. Jerome Daviot. The presentation will focus on an optimized cleaning solution to meet the challenges of post-etch residue (PER) removal of high-k materials such as tantalum, zirconium, and hafnium, which are notoriously resilient and difficult to remove.
About the Conference
The Surface Preparation and Cleaning Conference (SPCC) is the world’s largest conference dedicated to cleaning and preparation. The SPCC was managed by Sematech from 2002 – 2014 and taken over by Linx Consulting in 2015.
SPCC offers a unique opportunity for IC manufacturers, equipment makers, chemical and material suppliers, metrology and process monitoring suppliers, and researchers to hear presentations on cutting-edge cleaning technologies for the electronics industry. The scope of the conference encompasses front-end, back-end, equipment, materials, metrology, and issues in wafer cleaning.
The conference is comprised of invited presentations, reviewed technical oral presentations and posters covering all aspects of cleaning. Invited expert speakers will review key aspects of the surface preparation and cleaning markets.
To learn more about SPCC 2018, go to www.linxconferences.com/spcc/