Technic to Showcase Elevate® Electrodeposition Chemistries and Process Solutions at SEMICON China 2026

 

Technic will participate in SEMICON China 2026 from March 25–27 at the Shanghai New International Expo Centre (SNIEC).

Organized by SEMI and CECC, SEMICON China is a premier platform for showcasing microelectronics innovations to a highly qualified global audience. This year’s theme, Breaking Limits: Powering the AI Era, highlights the rapid advancement of AI-driven semiconductor technologies.

At Booth 2404, Technic will showcase its Elevate® electrodeposition chemistries for advanced semiconductor packaging, including applications such as RDL, pillars, microbumps, and LED packaging. The Elevate® Cu 3000 process delivers superior within-die and within-wafer plating performance with a stable additive package that can be easily analyzed using Technic’s patented Elevate Analyzer.

Technic also provides high-performance photoresist strippers, metal etchants, and cleaners under the TechniStrip®, TechniEtch®, and TechniClean™ brands. In addition, the Technic RTA 3D, a leading electro-analytical process control system for damascene copper and backend packaging, will be on display.

SEMICON China connects China with the global microelectronics industry and features themed pavilions focused on green manufacturing, heterogeneous integration, AI, smart mobility, silicon photonics, and precision machinery.

Technic’s participation underscores its continued commitment to semiconductor innovation and collaboration across the global supply chain.

Register here