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Process Results (11) Request More Information
TechniStrip® NF26
Versatile stripper for full dissolution of liquid and laminated photoresists.
- TechniStrip® NF26 completes the TechniStrip® NF52 product range.
- Ensures complete dissolution of both liquid (positive- and negative-tone) and laminated photoresists, while maintaining excellent compatibility with sensitive metal stacks.
TechniStrip® 680
Advanced 100% solvent-based blend for photoresist stripping and lift-off processes.
- DMSO-based process.
- Optimized formulation that offers a safer, more efficient alternative to conventional NMP, pure DMSO, or DMSO/amine strippers.
TechniStrip® Micro D2
Versatile photoresist stripper formulated to address resin lift-off and dissolution of negative and positive tone resist. TechniStrip Micro D2 is an environmentally friendly alternative for NMP, DMSO and DMSO/Amine based photoresist strippers.
- Non-hazardous replacement for NMP.
- Lower running cost and improved performance over NMP and DMSO-based resist strippers.
TechniStrip® Micro D350
100% solvent-based blend for photoresist stripping, lift-off processes.
- Non-hazardous alternative to pure NMP
- As efficient as pure NMP.
- High material compatibility, low metal ion contamination.
TechniStrip® Micro NGA883
Optimized solution for the removal of polyisoprene-based or rubber-like resins, BCB, and organic materials.
- Naphthalene, petroleum and catechol-free product.
- Considerably reduces EHS concerns and strong gasoline smell.
TechniStrip® MLO02
Stripper for positive-tone photoresist stripping, polyimide dissolution, and metal lift-off processes.
- Amine-based, low-toxicity stripper.
- Safer alternative to legacy NMP-based mixtures.
- Provides fast removal of resists and polyimides, while keeping a low metal ion contamination.
TechniStrip® MLO07
Stripper for Metal Lift-Off
- Highly efficient positive and negative tone photoresist remover.
- Used for IR, II/V, MEMS, photonic, TSV mask, solder bumping and hard disk stripping applications.
- Compatible with Cu, Al, Sn/Ag, Alumina, magnetic alloys and organic substrates such as polymide, parylene and others.
- Very efficient in metal lift off applications too.
TechniStrip® NF52
Advanced Stripper for Dry film Resist.
- Solvent-based stripper.
- Offers full dissolution with excellent metal compatibility and high loading capacity.
TechniStrip® NF90
TMAH-free stripper.
- Offers similar performance to TechniStrip NF52.
- High resin dissolution and excellent metal compatibility.
TechniStrip® NI555
Stripper for advanced AZ EM resist.
Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXT, AZ40XT, and AZnLOF 2000 series.
TechniStrip® P1331
Stripper for liquid resist.
- Wide range of applications.
- Ideal for use in backend applications like TSV, Cu pillar, bumping, etc.
- Offers complete dissolution of thick film resist with excellent metal compatibility.
- Water-based formulation.