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TechniEtch CuSelect

Selective Cu PVD etchant.

Characteristics:

Stabilized Hâ‚‚Oâ‚‚-based Cu seed etchant for UBM, RDL & Cu pillar applications.

  • High tunability & excellent Cu PVD/ECD selectivity.
  • Fully compatible with most metals such as Al, Ti, TiW, Ni.
  • Long, effective bath life.
  • Easily monitored by end-point detection.
  • Direct DI water rinsing.
Availability: North America, Asia Pacific, Europe
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