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Process Results (2) Request More Information
TechniClean CA25
PER Remover.
Characteristics:
Post Etch Residue remover that works effectively on various metal stacks including: Tungsten, Al and Cu.
Availability: North America, Asia Pacific, Europe
TechniClean CA585
Semi-aqueous cleaner designed for fast and selective removal of Post-Etch Residues (PER) for metal interconnect (Cu and Al).
Characteristics:
- Efficiently removes organo-metal oxides from Al, Alumina, Cu, Ti, TiN, W and Ni, offering a non-hazardous alternative to traditional amine- or fluoride-based PER cleaners.
- High metal compatibility.
- High cleaning efficiency at low temperature.
- Wide process window on both SST and single-wafer tools.
Availability: North America, Asia Pacific, Europe
