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Process Results (2) Request More Information

TechniEtch Al80

Selective and acidic Al etchant.

Characteristics:
  • Proven acidic aqueous etchant, based on the PAN-like family, specially formulated for Al, Cu, Ni and Ag.
  • Exhibits excellent stability, even in the presence of high levels of metal contamination.
  • Tailored mixture ratios can be provided upon request.
Availability: North America, Asia Pacific, Europe
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TechniEtch BAL220

Anisotropic, selective and alkaline Al & Al alloys etchant.

Characteristics:
  • Designed for selective Al, AlCu, Al(Sc)N, Al2O3 anisotropic etching in semiconductor processing.
  • Alkaline product with increased compatibility with Ni, Cu and others vs standard PAN-etch solutions.
  • Maintains high stability and loading capacity for optimized performance.
Availability: North America, Asia Pacific, Europe
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Equipment Results (2) Request More Information

RTA

Analysis of organic & inorganic levels in acid copper plating solution

Characteristics:

The RTA is an automated, on-line, real-time, and in-tank system for monitoring and controlling the levels of chemical constituents of plating baths.

Availability: Asia Pacific
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Test Cell

Wafer plating test cell

Characteristics:

Fully operational, tabletop wafer plating cell for process testing and analysis.

Availability: North America, Asia Pacific, Europe
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