English
Italian
Begin your search by selecting the Application, Process and Category or by specifying keyword(s)
Process Results (4) Request More Information
Elevate AuSn 8020
Eutectic gold-tin
Elevate Gold 7900 Deplate
Elevate Gold 7900 Deplate is used to remove seed layer gold from gold electroplated semiconductors using reverse current. It can also be used for applications that require the removal of some or all of an electroplated gold deposit.
- Cyanide-free
- Completely removes seed layer gold without changing the appearance of electroplated gold
- All liquid formulation
Elevate Gold 7934
High purity, soft gold plating
Elevate Gold 7990 NBV HT
Cyanide, Thallium and Arsenic-free Gold Plating
Electrolytic sulfite gold process for semiconductor applications that produces pure, soft gold deposits. Operates at an optimum acidic pH of 6.6, making it compatible with almost all photoresists. It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. Provides excellent coplanarity and step coverage. Can be used for plating several different applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution and can be used on a variety of tool sets.
