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Process Results (6) Request More Information
TechniEtch AT 2000
PCB specific: Pre-clean.
TechniEtch AT 2000 is an ammonia-free, fine topography persulfate micro etch designed for use in pretreatment cycles for printed circuit boards and other copper surfaces.
PCB specific: Immersion Palladium, dense pore free deposit.
Pallamerse is an immersion palladium process that applies a dense, pore-free coating of palladium on base metals like copper, silver and nickel. Used as a Catalyst for EPIG
Techni X-Cell 318
PCB specific: Pattern Plate Pre-clean
Techni X-Cell 318 is a liquid acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.
PCB specific: Acid cleaner, spay or soak.
TechniClean 207AP is a liquid low-foam acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.
PCB specific: Electroless Palladium, Pure Palladium deposit.
TechniPad 7611 is a stable, autocatalytic, electroless palladium plating solution. It is designed to deposit a pure palladium deposit on electroless nickel to improve solderability and provide a surface for both aluminum and gold wire bonding.
Technipad AU 6100
PCB specific: Immersion Gold, controlled deposition, Cyanide base chemistry. For ENIG and ENEPIG.
TechniPad Au 6100 is a cyanide-based immersion gold plating process designed to provide a controlled deposition of thin pure gold deposits onto electroless nickel and electroless palladium.