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Process Results (15) Request More Information

Techni BT 1000

Bright tin for reel-to-reel applications

Characteristics: Sulfate based electrolytic tin plating process, bright deposit.
Availability: Europe
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Techni BT2

Low speed bright Tin

Characteristics: Sulfate based electrolytic tin plating process, bright deposit. Suitable for rack and barrel applications
Availability: Europe
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Techni Eco Antioxidant

Technic ECO ProductProduct to prevent Tin oxidation in all Tin plating processes. This product prevents the formation of sludge due to tetravalent tin, thus extending bath life.

Characteristics:

Suitable for all acid Tin process (bright and matte). Cancerogenic and SVHC substances free. Full analyzable.

Availability: Europe
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Techni Eco BT 2

Technic ECO ProductBright acid Tin process based on Tin sulphate and Sulfuric acid. The process is free from cancerogenic substances, suitable for barrel and rack applications.

Characteristics:

Cancerogenic substances free. Bright and uniform deposit at all current densities. Easy to manage and inexpensive process.

Availability: Europe
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Techni Matte Tin Sulfate 89TI

Matte Tin for rack and barrel

Characteristics: Low operating cost. Good product for most technology types. Optimum distribution in the range of 15 - 20 ASF.
Availability: North America, Europe
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Techni NF JB 3000

High speed bright tin plating process. MSA based electrolyte.

Characteristics: Bright, whisker resistant pure tin based on MSA. Satisfies all requirements of JEDEC JESD 201.
Availability: North America, Asia Pacific, Europe
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Techni NF JM 3000

High speed MSA based matte tin plating process. Fully compatible with Techni NF JB 3000 bright tin. Excellent solderability and resistance to reflow discoloration.

Characteristics: High speed matte tin plating process based on MSA. Fully compatible with Techni NF JB 3000 bright tin.
Availability: North America, Europe
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Techni NF TP-NT

Techni NF TP-NT process is a high speed matte pure tin electroplating process specifically formulated for the continuous strip and wire plating industry. Based on a methane sulfonic acid electrolyte containing a powerful antioxidant that minimizes oxidation of stannous tin. The current density range of the process is exceptionally wide, which allows the strip/wire line operator to maintain a low tin concentration in the plating bath without sacrificing line speed. Deposits have a lustrous matte to semi-bright finish, and are uniform in appearance at all usable current densities.

Characteristics: Exceptionally wide current density range Deposits exhibit excellent visual deposit uniformity across the entire current density range Non-foaming electrolyte Operation at elevated temperatures up to 55°C
Availability: North America, Asia Pacific, Europe
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Techni Solder NF W

High speed matte/satin pure tin for wire applications.

Characteristics:
  • Organic MSA-based process
  • Non-foaming electrolyte
  • Deposits exhibit excellent solderability with low organic co-deposition
  • Easily analyzed bath components
  • Single component grain refiner
  • Exceptionally wide current density range
Availability: Europe
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TechniBrite 3111

Barrel & Rack bright tin plating

Characteristics: Industry standard in low speed bright tin plating process, non hazardous additive system with even thickness distribution
Availability: Asia Pacific
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Technibrite HT 1000

Technibrite HT 1000 is Technic’s most advanced bright tin process for rack and barrel applications. The process eliminates tin metal growth problems by operating at higher cathode efficiencies and warmer temperatures. With its exceptional low current density bright range, complex geometry parts are uniformly bright in all areas.

Characteristics: Wide temperature operating range: 20 - 35°C (68 - 95°F). Exceptional low current density bright range. Deposit is whisker mitigated per JEDEC 208 test protocol.
Availability: North America, Asia Pacific, Europe
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TechniBrite RWB 1000

Low-speed pure tin plating process that produces reduced organic “white bright” deposits.  It has been shown to be successful at plating very uniform part to part and area to area in barrel applications.  The deposit it generates is a standout in the industry.

Characteristics:

Reduced hydrogen generation during plating eliminates striations and pits.  Can be used on very rough, uneven surfaces unlike full bright tin, which tends to require smooth, etched surface. 

Availability: North America, Asia Pacific, Europe
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Technistan TP

High speed matte tin sulfate process designed for use on lines with in-line tin reflow furnaces.

Characteristics: High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.
Availability: North America, Asia Pacific
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Technistan TP-5000

High speed matte tin sulfate process designed for use on lines with in-line tin reflow furnaces.

Characteristics:

High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.

Availability: Asia Pacific, Europe
Add Remove

Technistan TP-W

High speed matte/satin pure tin for wire applications.

Characteristics:
  • Based on sulfuric acid technology
  • Offers significant cost advantages to MSA systems
  • RoHS compliant
  • Single-component grain refiner
Availability: North America, Asia Pacific, Europe
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Equipment Results (7) Request More Information

Ancillary Plating Equipment

Upgrades, spare or replacement parts for all plating operations

Characteristics:

DC rectifiers, PPR rectifiers, amp hour meters, heaters, filters, ultrasonics, spare parts, retrofits and upgrades.

Availability: North America
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CDPP-2000

Controlled Depth Pin Processing

Characteristics:

Continuous, fully enclosed, controlled depth processor for pin plating. Fully automatic cartridge loading and unloading with fast and easy part changeovers.

Availability: North America, Asia Pacific, Europe
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Gold Saver - Resin Recovery System

Recovery of gold and silver

Characteristics:

Gold reclaim system for in tank filter type.

Availability: North America, Europe
Add Remove

Hoist Systems

Hoist systems for electroplating, electropolishing, chromating, cleaning, anodizing, phosphating and E-Coat.

Characteristics:

Custom and turnkey design, vertical plating lines with complete automatic or semi-automatic operation.

Availability: North America, Asia Pacific, Europe
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Manual Plating Lines and Auxiliary Equipment

Manual equipment and supplies for a variety of applications.

Characteristics:

Complete manual plating lines are custom designed to meet customer specification.

Availability: North America, Europe
Add Remove

SBE

Spouted Bed Electrode (SBE®)

Characteristics:

Technic's patented method of electroplating small components such as electronic connectors, discs, pins and SMT chip capacitors and chip resistors.

Availability: North America, Asia Pacific, Europe
Add Remove

Technic Solid State amp hour/minute meters

All electroplating processes

Characteristics:

Measurement of and replenishment of all electroplating solutions.

Availability: North America, Europe
Add Remove
Finish Request

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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Analytical Control (RTA)
      • Semiconductor Equipment
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
        • Semcon Wafer Racks
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • Electronic Component Chemistry
        • Connectors
          • - Precious Metals
          • - Non-precious Metals
          • - Post-Treatment
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • Electronic Component Finishing Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
        • - ASIG
      • Imaging Products
        • Photoimageable Materials
          • - TechniFlex LCL
        • IRP Thermosetting Inks
        • Conductive Silver Paste
        • LED Inks
        • Peelable Masks
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Energy Technologies
      • Energy Technologies
        • Hydrogen Technology
      • Engineered Powder & Flake
    • Technic ECO Products
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post-Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
          • - How it works
          • - Configurations
          • - Automation
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Anodizing Equipment
      • Anodizing Mini-Plant
      • Apex Modular Anodizing Equipment
      • Custom Anodizing Equipment
      • Titanium Anodizing Equipment
      • Anodizing Resources
        • What Anodizing System if right for me.
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        • Demonstration Videos
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          • Advanced Engineered Systems
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
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      • Electropolishing
  • Engineered Powders
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        • Tape Application Jig
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  • About
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