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Process Results (6) Request More Information

Pallaspeed 990

Palladium plating process

Characteristics: Chloride-free, low ammonia palladium plating process designed to produce highly ductile palladium deposits.
Availability: North America, Asia Pacific
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Pallaspeed Palladium Nickel NFA

Technic ECO Product
Palladium Nickel alloy plating process (70-90% Palladium) containing no free ammonia.

Characteristics:

A chloride-free, alloy plating process containing no free ammonia. The deposit finish is semibright to full bright Deposit properties include good ductility and low porosity.

Availability: North America, Asia Pacific, Europe
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Pallaspeed VHS

High speed pure Palladium plating process based on Palladium ammonium chloride.

Characteristics: Bright deposit. Deposits exhibit good ductility and moderate stress.
Availability: North America, Asia Pacific, Europe
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Technic Palladium Nickel 900 TC

Pd/Ni alloy, semi-bright to bright , 70-90% Palladium

Characteristics: Low ammonia Pd/Ni plating process, chloride based electrolyte. Capable of depositing Pd/Ni alloys containing 70/90% Palladium.
Availability: Asia Pacific
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Technic Palladium Nickel AF-LS

Ammonia-free Palladium Nickel alloy barrel plating process (65-90% Palladium)

Characteristics: Ammonia-free process yielding semi-bright to bright deposits. Low pH provides enhanced adhesion to nickel substrates. Operates at 3-25 ASF.
Availability: North America, Asia Pacific
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Technic Palladium Nickel VHS

Pd/Ni alloy, semi-bright to bright , 70-90% Palladium

Characteristics: Conventional Pd/Ni plating process, chloride based electrolyte. Capable of depositing Pd/Ni alloys containing 70-90% Palladium.
Availability: North America, Asia Pacific
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Equipment Results (6) Request More Information

Ancillary Plating Equipment

Upgrades, spare or replacement parts for all plating operations

Characteristics:

DC rectifiers, PPR rectifiers, amp hour meters, heaters, filters, ultrasonics, spare parts, retrofits and upgrades.

Availability: North America
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CDPP-2000

Controlled Depth Pin Processing

Characteristics:

Continuous, fully enclosed, controlled depth processor for pin plating. Fully automatic cartridge loading and unloading with fast and easy part changeovers.

Availability: North America, Asia Pacific, Europe
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Gold Saver - Resin Recovery System

Recovery of gold and silver

Characteristics:

Gold reclaim system for in tank filter type.

Availability: North America, Europe
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Manual Plating Lines and Auxiliary Equipment

Manual equipment and supplies for a variety of applications.

Characteristics:

Complete manual plating lines are custom designed to meet customer specification.

Availability: North America, Europe
Add Remove

Reel to Reel

Fully automatic reel to reel processing systems for overall plating, controlled depth, selective stripe, and selective spot.

Characteristics:

Custom designed continuous, reel-to-reel plating systems deliver precisely deposited gold, silver, copper, nickel, tin, tin/lead, palladium and palladium nickel over any ferrous or non ferrous metal.

Availability: North America, Asia Pacific, Europe
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SBE

Spouted Bed Electrode (SBE®)

Characteristics:

Technic's patented method of electroplating small components such as electronic connectors, discs, pins and SMT chip capacitors and chip resistors.

Availability: North America, Asia Pacific, Europe
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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Analytical Control (RTA)
      • Semiconductor Equipment
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
        • Semcon Wafer Racks
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • Electronic Component Chemistry
        • Connectors
          • - Precious Metals
          • - Non-precious Metals
          • - Post-Treatment
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • Electronic Component Finishing Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
        • - ASIG
      • Imaging Products
        • Photoimageable Materials
          • - TechniFlex LCL
        • IRP Thermosetting Inks
        • Conductive Silver Paste
        • LED Inks
        • Peelable Masks
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Energy Technologies
      • Energy Technologies
        • Hydrogen Technology
      • Engineered Powder & Flake
    • Technic ECO Products
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post-Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
          • - How it works
          • - Configurations
          • - Automation
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Anodizing Equipment
      • Anodizing Mini-Plant
      • Apex Modular Anodizing Equipment
      • Custom Anodizing Equipment
      • Titanium Anodizing Equipment
      • Anodizing Resources
        • What Anodizing System if right for me.
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        • Demonstration Videos
      • Equipment Support
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          • Advanced Engineered Systems
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Products
    • Global Offices & Distributors
    • Equipment
      • Conductivity Test Apparatus
        • Tape Application Jig
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    • Contact Us
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    • Global Facilities
      • EU Distributors
    • ISO 9001 Registration Certificate
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