Fabrication & Packaging Electroplating Chemistries for Advanced Semiconductor Applications
Technic’s semiconductor fabrication and packaging electroplating chemistries, marketed under the name Elevate®, are well respected for innovation and high quality. Elevate® processes offer high performing electroplating chemistries for copper, nickel, tin and precious metals. In addition Technic supplies photoresist strippers for liquid and dryfilm resist as well as metal etchants and cleaners for a variety of substrates.
Technic products provide a number of specific attributes that allow semiconductor manufacturers to remove many process limitations and take their technology to a new level. Our semiconductor fabrication and packaging chemistries are widely used in several advanced packaging platforms including FOWLP (Fan Out Wafer Level Packaging), Fan In WLP, Flip Chip and 2.5/3D.
Technic supplies a variety of copper plating processes that can meet all industry requirements for multiple semiconductor applications and will provide optimum performance in various production tool sets.
Nickel & Tin
Technic offers a standard nickel process and a boric acid free nickel process. In addition, we offer a silver free solder cap option by providing a pure tin process ideal for advanced packaging. All nickel and tin processes are low maintenance and easy to use.
Technic's line of precious metal products range from our industry leading sulfite gold chemistry to the very unique one step gold-tin alloy plating bath.
Technic supplies photoresist strippers for full dissolution and/or lift off of all types of photoresist resins. These strippers provide high performance without the use of harmful chemicals like NMP. Our industry leading TechniStrip® products offer high metal compatibility and an extended bath life and can be used in all types of production stripping tools.
Technic's proprietary etchants are being used around the world in various applications. They provide very high metal selectivity and a long bath life and are formulated to meet the challenges of advanced technology in the fabrication and packaging industry.
Technic offers proprietary solutions for Post Etch Residue (PER) cleaning. These chemically safe cleaners have extremely high metal compatibility for a wide variety of substrates and can be used in all types of production tools.