Metallization

Highly Effective PCB Metallization Solutions

• Palladium
• Graphite
• Electroless Copper

Palladium - Direct Metallization

Palladium process: similar to electroless copper, without the need of plating a copper layer.

Conditioning

Circudep DM CC 124 - is a concentrated blend of surfactants and wetting agents designed to clean the copper foil surfaces of printed circuit boards. It is an important part of the non-electroless plating process. Circudep DM CC 124 has been formulated to remove fingerprints and light oils from copper foil laminate. It contains conditioning agents which activate glass fibers and epoxy, allowing for absorption of the activator/catalyst Circudep DM CC 124 onto the surface.

Micro-etch

You may select any micro-etch from our list of Preclean and Micro-etchant solutions.

Pre-dip

Circudep DM PD 55 is an acidic-salt solution designed to improve the efficiency of the catalyst. It helps keep the concentration of some key elements optimum while improving the efficiency of the catalyst deposition on the substrates.

Activation

Circudep DM CT 60 is designed to help produce a conductive coating on non-conductive surfaces. The final surface coating can either be plated with electrolytic copper. Circudep DM CT 60 contains a special blend of acidic and organic compounds that help it increase the coating's deposit energy. The Circudep DM CT-60 solution is followed by the Circudep DM AC-170 Accelerator step. It produces the final link of the coating that produces a highly conductive surface.

Accelerator

Circudep DM AC 170 is the final step in the Direct Metallization plating process. Used after Circudep DM CT 60,  Circudep DM AC 170 produces a metallic conductive coating on the surface with a significant enough thickness that allows for electrolytic plating. It has been designed to change the surface metallic complex of the Palladium/Tin coating, producing a second metallic network. Curcudep DM AC 170 changes the deposit structure and allows for both electroless and electrolytic deposition of metal.

Anti-Tarnish

Techni AT 66 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide a temporary tarnish protection for copper. The Techni AT 66 has been formulated to remove light copper oxides and leave behind a chemically bonded anti-tarnish organic film. This clean protective surface will allow better bonding of dry film and other photo resists to the copper surface. The treated surface will prevent surface oxidation, tarnishing and staining. Techni AT 66 does not contain any chromates or waxes and can easily be removed with a mild surface etch.

Graphite Metallization Process

Our graphite process has been the "greener" choice of direct metalization for 25 years. It uses less water for rinsing with fewer chemicals than Electroless Copper. This horizontal process has been recently improved for even better performance.

Conditioning

Circudep G 3500 is the next-generation Alkaline Cleaner Conditioner designed for graphite. Circudep G 3500 has a strong conditioning action, which ensures total coverage of the exposed glass fibers and epoxy resin in the hole wall. Circudep G 3500 can be used in both vertical immersion and flood conveyorized process systems giving high and constant activity at low temperatures and short contact times. Circudep G 3500 is highly efficient when processing PTFE and other soft board substrates.

Graphite

Circudep G 4300 is a fine particle graphite-based direct metallization process specifically formulated for use in horizontal flood conveyor systems. This colloidal process provides conductive particles of between 0.4 and 0.8 microns that are extremely conductive and ensure complete coverage of the charged substrate ideal for subsequent Copper electroplating. Using Circudep G 4300 makes it possible to process high aspect ratio multilayers along with buried via and panels with small hole technologies. Circudep G 4300 is extremely stable and can be used constantly or with intermittent workloads, separation and sludge are eliminated due to the solution’s chemical stabilizers. Circudep G 4300 operates at minimal solid content giving not only a stable solution but also excellent process yields. This easy-to-control process demonstrates consistent results and ease of use, making it a real alternative to Electroless Copper.

Post-dip

Circudep G 5070 is the third step in the Graphite process.  It is an acidic solution necessary to remove excess graphite and improves the conductivity of the coating. Circudep G 5070 enhances the adhesion of graphite on the hole walls and when used in a spay helps in the processing of blind and through microvias.

Micro-etch

Techni CU 85 is a heavy-duty ammonia-free peroxysulfate micro etch specifically designed to deoxidize and/or activate copper surfaces before electroplating. Techni CU 85 can also be used on Alloy 42 substrates.

Anti-Tarnish

Techni AT 66 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide temporary tarnish protection for copper. Techni AT 66 has been formulated to remove light copper oxides and leave behind a chemically bonded anti-tarnish organic film. This clean protective surface will allow better bonding of dry film and other photo resists to the copper surface. The treated surface will prevent surface oxidation, tarnishing, and staining. Techni AT 66 does not contain any chromates or waxes and can easily be removed with a mild surface etch.

Electroless Copper

(Statement)

Conditioning

Circudep EC CC 18 contains conditioning agents which activate glass fibers, epoxy, and other non-conductive materials, allowing for a reliable absorption of the palladium catalyst in subsequent processing. Circudep EC CC 18 is a critical component in the Electroless copper process sequence, suitable for use on non-conductive substrates. 

Micro-etch

We reccomend using Technic AT 2000

Pre-dip

Circudep EC PD 70 is a neutral solution that prepares non-conductive substrate materials for uniform absorption of the palladium catalyst. Circudep PD 70 is a critical component in the Electroless copper process sequence, suitable for use on non-conductive substrates.

Activation

Circudep EC CT 74 provides a highly charged colloid that promotes a uniform, highly adherent electroless copper deposit.

Circudep EC CT 74 is a highly stable chemistry with a low halogen content which minimizes substrate attack and produces a highly absorbent palladium deposit. CCircudep EC CT 74 is a critical component in the Electroless process sequence, suitable for use on non-conductive substrates.

Accelerator

Circudep EC AC 77 is a non-fluoride product that optimizes catalyst activity on non-conductive substrates, providing void-free electroless copper deposits. Circudep EC AC 77 provides a unique chemical mechanism that produces a reliable electroless copper deposit. Circudep EC AC 77 is a critical component in the Electroless copper process sequence, suitable for use on non-conductive substrates.

Electroless Copper

Circudep EC EC 92 is a medium-depth electroless copper system engineered to deposit a pure, fine-grained, equiaxed copper. Circudep EC EC 92 is engineered to work with today’s sophisticated non-conductive substrates. Circudep EC EC 92 is a critical component in the Electroless copper process sequence, suitable for use on non-conductive substrates.

Anti-Tarnish

Techni AT 66 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide temporary tarnish protection for copper. The Techni AT 66 has been formulated to remove light copper oxides and leave behind a chemically bonded anti-tarnish organic film. This clean protective surface will allow better bonding of dry film and other photo resists to the copper surface. The treated surface will prevent surface oxidation, tarnishing, and staining. Techni AT 66 does not contain any chromates or waxes and can easily be removed with a mild surface etch.