Connector Finishing Chemistry

Goldeneye Nickel / Goldeneye Nickel II

• Goldeneye Nickel is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte.  Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel can be utilized in reel to reel, rack and barrel plating applications.

Techni Gold^® 800/900

• Techni Gold^® 800/900 are mildly acidic nickel/cobalt brightened gold plating processes designed to minimize gold porosity in electronic connector plating applications. Techni Gold^® 800/900 are suitable for use in reel-to-reel and barrel plating applications.

Techni Silver^® HCD

• Techni Silver^® HCD is a silver plating solution designed for reel to reel, strip and spot plating connector applications, with elevated hardness levels compared to conventional silver.  Suitable as a gold replacement when used with lubricant-type post-treatment processes. 

Durasil^® Silver

• Durasil^® silver provides a hard silver deposit for connector applications.  Requires a lubricant for wear-resistant applications.

Pallaspeed^® 990

• Pallaspeed^® 990 is a chloride-free, low ammonia palladium plating process designed to produce highly ductile, low stress palladium deposits. Suitable for use as an intermediate/barrier layer for high-corrosion resistance applications.

Pallaspeed^® Palladium Nickel NFA

• Pallaspeed^® Palladium Nickel NFA is a chloride-free, Pd-Ni alloy plating process containing no free ammonia for connector applications. The composition of the alloy can be adjusted from 70-90% palladium by changing the metal content. 

Techni White Rhodium
Techni White Rhodium-Ruthenium
Techni White Rhodium-Palladium

• The Techni White Rhodium series of rhodium-based finishes is recommended to provide the ultimate in corrosion protection, particularly for satisfying end user imposed electrolytic sweat test requirements. Techni White Rhodium-Palladium provides the optimum combination of ease of operation and results for the most demanding applications. 

Techni NF JM8000

• Specifically designed for the ultra-high, high, and medium speed deposition of matte tin with minimal tin whisker growth properties, Techni NF JM 8000 provides a lead-free deposit from a methane sulfonic acid electrolyte.  The process can be also used in on-line reflow applications.

Techni HT 1000

• TechniBrite HT 1000 is a sulfate-based tin electroplating process which produces mirror bright deposits.  The process is designed for use in rack and barrel plating applications.  The process operates over a wide current density range resulting in increased output and flexibility in production, and is not sensitive to high solution tin concentrations.