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Process Results (6) Request More Information

JM 6000

Matte tin or tin/lead plating process. MSA based electrolyte

Characteristics: Medium grained, high speed, matte tin whisker resistant plating process based on MSA. Satisfies all requirements of JEDEC JESD 201. Can be formulated as a tin/lead process.
Availability: Asia Pacific
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Techni NF JM 6000

High speed tin lead for reel to reel strip plating

Characteristics: Medium grained, high speed, MSA based, matte whisker resistant tin plating process. Satisfies all requirements of JEDEC JESD 201. Available as a tin/lead process.
Availability: North America, Asia Pacific, Europe
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Techni NF JM 8000

MSA tin process that can be used in rack, barrel and high speed RTR equipment.

Characteristics: Specifically designed for ultra-high, high, and medium speed, MSA based matte tin deposition with outstanding whisker resistance (JEDEC compliant). Excellent on-line reflow performance. Superior deposit uniformity and throwing power.
Availability: North America, Asia Pacific, Europe
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TechniBrite RWB 1000

Low-speed pure tin plating process that produces reduced organic “white bright” deposits.  It has been shown to be successful at plating very uniform part to part and area to area in barrel applications.  The deposit it generates is a standout in the industry.

Characteristics:

Reduced hydrogen generation during plating eliminates striations and pits.  Can be used on very rough, uneven surfaces unlike full bright tin, which tends to require smooth, etched surface. 

Availability: North America, Asia Pacific, Europe
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Technistan EP

Technic ECO ProductLead-free, High Speed Electrolytic Matte Tin.

Characteristics:

Technistan EP is a high speed, pure tin whisker resistant plating process based on Technic’s proprietary and patented mixed acid technology. Industry standard for Pb-free plating for more than 10 years.

Availability: North America, Asia Pacific
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Technistan JM 7000

Sulfate tin process that can be used in rack, barrel and high speed RTR equipment.

Characteristics: Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great throwing power, even with high tin formulations. Sulfate formulation eliminates potential problems with lead co-depos
Availability: North America, Asia Pacific, Europe
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Equipment Results (5) Request More Information

Ancillary Plating Equipment

Upgrades, spare or replacement parts for all plating operations

Characteristics:

DC rectifiers, PPR rectifiers, amp hour meters, heaters, filters, ultrasonics, spare parts, retrofits and upgrades.

Availability: North America
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Gold Saver - Resin Recovery System

Recovery of gold and silver

Characteristics:

Gold reclaim system for in tank filter type.

Availability: North America, Europe
Add Remove

Reel to Reel

Fully automatic reel to reel processing systems for overall plating, controlled depth, selective stripe, and selective spot.

Characteristics:

Custom designed continuous, reel-to-reel plating systems deliver precisely deposited gold, silver, copper, nickel, tin, tin/lead, palladium and palladium nickel over any ferrous or non ferrous metal.

Availability: North America, Asia Pacific, Europe
Add Remove

SP-2001 Cut Strip Leadframe Plating System

Automatic leadframe plating system

Characteristics:

Continuous operation of the system insures uniform deposit, eliminating the need for solder dipping. Manually loaded, semi-automatic, capable of 600 strips/hour to fully automatic with load and unload capable of 1200 to 2400 strips/hour.

Availability: North America, Asia Pacific
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Water Recycling System

Rinse water recycling system

Characteristics:

Rinse Water or wastewater reuse after purification and deionization.

Availability: Asia Pacific
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Finish Request

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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Analytical Control (RTA)
      • Semiconductor Equipment
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
        • Semcon Wafer Racks
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • Electronic Component Chemistry
        • Connectors
          • - Precious Metals
          • - Non-precious Metals
          • - Post-Treatment
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • Electronic Component Finishing Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
        • - ASIG
      • Imaging Products
        • Photoimageable Materials
          • - TechniFlex LCL
        • IRP Thermosetting Inks
        • Conductive Silver Paste
        • LED Inks
        • Peelable Masks
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Energy Technologies
      • Energy Technologies
        • Hydrogen Technology
      • Engineered Powder & Flake
    • Technic ECO Products
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post-Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
          • - How it works
          • - Configurations
          • - Automation
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Anodizing Equipment
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      • Custom Anodizing Equipment
      • Titanium Anodizing Equipment
      • Anodizing Resources
        • What Anodizing System if right for me.
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        • Demonstration Videos
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          • Advanced Engineered Systems
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
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    • Global Facilities
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