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Process Results (3) Request More Information

Goldeneye Nickel BF

Technic ECO ProductGoldeneye Nickel BF is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte. Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel BF can be utilized in reel to reel, rack and barrel plating applications. Goldeneye Nickel BF uses a revolutionary new buffering agent (Goldeneye Ni Buffer BF) which is completely free of all boron compounds.
 

Characteristics:

Improved corrosion resistance compared to sulfate or sulfamate plating processes. Superior thickness distribution. Improved low current density coverage. Increased solution conductivity. Reduced waste treatment costs. Operates over a wide current density range, reel to reel, rack and barrel. Produces a nickel deposit which meets the requirements of AMS-QQ-N-290B (Rev. 2009-07), Class 1, “SB”. Completely free of all boron compounds.

Availability: North America, Asia Pacific, Europe
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Goldeneye Nickel Tungsten

Goldeneye Nickel Tungsten is designed to deposit a Ni/W alloy in applications requiring superior corrosion resistance, mechanical strength, high hardness, excellent wear, and other properties. It is suitable for reel to reel, rack or barrel plating equipment. Goldeneye Nickel Tungsten requires no special rectification and the process can be implemented in existing plating lines with minimal to no modifications. 

Characteristics: Highly corrosion resistant
High hardness with excellent wear and mechanical properties
Non-magnetic coating, suitable for high frequency applications (5G)
DC plating; no special rectification required
Availability: North America, Asia Pacific, Europe
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High Speed Nickel Sulfamate FFP BF

Technic ECO ProductHigh speed nickel sulfamate plating process.

Characteristics:

High speed Nickel plating process producing low stress, ductile nickel deposits.  Also available in boric acid-free version FFP-BF.

Availability: North America, Asia Pacific, Europe
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Equipment Results (5) Request More Information

Ancillary Plating Equipment

Upgrades, spare or replacement parts for all plating operations

Characteristics:

DC rectifiers, PPR rectifiers, amp hour meters, heaters, filters, ultrasonics, spare parts, retrofits and upgrades.

Availability: North America
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Gold Saver - Resin Recovery System

Recovery of gold and silver

Characteristics:

Gold reclaim system for in tank filter type.

Availability: North America, Europe
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Reel to Reel

Fully automatic reel to reel processing systems for overall plating, controlled depth, selective stripe, and selective spot.

Characteristics:

Custom designed continuous, reel-to-reel plating systems deliver precisely deposited gold, silver, copper, nickel, tin, tin/lead, palladium and palladium nickel over any ferrous or non ferrous metal.

Availability: North America, Asia Pacific, Europe
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SP-2001 Cut Strip Leadframe Plating System

Automatic leadframe plating system

Characteristics:

Continuous operation of the system insures uniform deposit, eliminating the need for solder dipping. Manually loaded, semi-automatic, capable of 600 strips/hour to fully automatic with load and unload capable of 1200 to 2400 strips/hour.

Availability: North America, Asia Pacific
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Water Recycling System

Rinse water recycling system

Characteristics:

Rinse Water or wastewater reuse after purification and deionization.

Availability: Asia Pacific
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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Analytical Control (RTA)
      • Semiconductor Equipment
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
        • Semcon Wafer Racks
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • Electronic Component Chemistry
        • Connectors
          • - Precious Metals
          • - Non-precious Metals
          • - Post-Treatment
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • Electronic Component Finishing Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
        • - ASIG
      • Imaging Products
        • Photoimageable Materials
          • - TechniFlex LCL
        • IRP Thermosetting Inks
        • Conductive Silver Paste
        • LED Inks
        • Peelable Masks
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Energy Technologies
      • Energy Technologies
        • Hydrogen Technology
      • Engineered Powder & Flake
    • Technic ECO Products
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post-Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
          • - How it works
          • - Configurations
          • - Automation
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Anodizing Equipment
      • Anodizing Mini-Plant
      • Apex Modular Anodizing Equipment
      • Custom Anodizing Equipment
      • Titanium Anodizing Equipment
      • Anodizing Resources
        • What Anodizing System if right for me.
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      • Mazerustar Planetary Mixers
        • Demonstration Videos
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      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Products
    • Global Offices & Distributors
    • Equipment
      • Conductivity Test Apparatus
        • Tape Application Jig
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    • Daily Metal Prices
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    • ISO 9001:2015 Certification
    • Contact Us
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    • Process Control Products
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        • PHD Option
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  • About
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      • Senior Key Account Manager – Specialty Chemical Semiconductor (Europe)
    • Global Facilities
      • EU Distributors
    • ISO 9001 Registration Certificate
    • Technic SDS Access