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Process Results (14) Request More Information

Orosene 990 HS

Hard gold for high speed applications

Characteristics:

Very high efficiency, high speed bright plating solution. The solution can be operated at low gold concentrations and at temperatures to 150 F, providing high plating rates with excellent deposit distribution.

Availability: North America, Asia Pacific
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Techni Gold 1020C (EG)

Cobalt hardened gold process

Characteristics: Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution. Lower operation cost.
Availability: Asia Pacific
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Techni Gold 1020C (HH)

Cobalt hardened gold process

Characteristics: Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution. Anti-gold immersion.
Availability: Asia Pacific
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Techni Gold 1020C (HS)

Cobalt hardened gold process

Characteristics: Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution.
Availability: North America, Asia Pacific
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Techni Gold 300

Nickel hardened gold plating process

Characteristics:

High performance nickel hardened gold plating process for low speed, high speed, and selective applications. Very tolerant to metallic contamination.

Availability: North America, Europe
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Techni Gold 300R

Nickel hardened gold plating process

Characteristics: General purpose, nickel hardened gold plating process for connector applications.
Availability: Asia Pacific
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Techni Gold 400

Cobalt hardened gold plating process

Characteristics: High performance cobalt hardened gold plating process for low speed, high speed, and selective applications. Very tolerant to metallic contamination.
Availability: North America, Europe
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Techni Gold 400R

Cobalt hardened gold plating process

Characteristics: General purpose, cobalt hardened gold plating process for connector applications.
Availability: Asia Pacific
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Techni Gold 434 HS

Pure gold plating process

Characteristics:

434 Acid Pure Gold process is designed to produce a gold electrodeposit of 99.9+% purity for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits are required to meet wire bonding requirements.

Availability: North America, Asia Pacific
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Techni Gold 800

Nickel hardened gold plating process.

Characteristics: Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.
Availability: North America, Asia Pacific, Europe
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Techni Gold 900

Cobalt hardened gold plating process

Characteristics: Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.
Availability: North America
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Techni Gold Barrel 850

Nickel hardened barrel gold plating process

Characteristics: Gold plating process designed to minimize porosity in electronic component and connector barrel plating applications.
Availability: Asia Pacific
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Techni Gold Flash 850

Nickel hardened flash gold plating process

Characteristics: Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.
Availability: North America, Asia Pacific
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Techni Gold Flash 950

Cobalt hardened flash gold plating process

Characteristics: Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.
Availability: North America, Asia Pacific
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Equipment Results (6) Request More Information

Ancillary Plating Equipment

Upgrades, spare or replacement parts for all plating operations

Characteristics:

DC rectifiers, PPR rectifiers, amp hour meters, heaters, filters, ultrasonics, spare parts, retrofits and upgrades.

Availability: North America
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CDPP-2000

Controlled Depth Pin Processing

Characteristics:

Continuous, fully enclosed, controlled depth processor for pin plating. Fully automatic cartridge loading and unloading with fast and easy part changeovers.

Availability: North America, Asia Pacific, Europe
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Gold Saver - Resin Recovery System

Recovery of gold and silver

Characteristics:

Gold reclaim system for in tank filter type.

Availability: North America, Europe
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Manual Plating Lines and Auxiliary Equipment

Manual equipment and supplies for a variety of applications.

Characteristics:

Complete manual plating lines are custom designed to meet customer specification.

Availability: North America, Europe
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Reel to Reel

Fully automatic reel to reel processing systems for overall plating, controlled depth, selective stripe, and selective spot.

Characteristics:

Custom designed continuous, reel-to-reel plating systems deliver precisely deposited gold, silver, copper, nickel, tin, tin/lead, palladium and palladium nickel over any ferrous or non ferrous metal.

Availability: North America, Asia Pacific, Europe
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SBE

Spouted Bed Electrode (SBE®)

Characteristics:

Technic's patented method of electroplating small components such as electronic connectors, discs, pins and SMT chip capacitors and chip resistors.

Availability: North America, Asia Pacific, Europe
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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Analytical Control (RTA)
      • Semiconductor Equipment
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
        • Semcon Wafer Racks
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • Electronic Component Chemistry
        • Connectors
          • - Precious Metals
          • - Non-precious Metals
          • - Post-Treatment
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • Electronic Component Finishing Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
        • - ASIG
      • Imaging Products
        • Photoimageable Materials
          • - TechniFlex LCL
        • IRP Thermosetting Inks
        • Conductive Silver Paste
        • LED Inks
        • Peelable Masks
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Energy Technologies
      • Energy Technologies
        • Hydrogen Technology
      • Engineered Powder & Flake
    • Technic ECO Products
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post-Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
          • - How it works
          • - Configurations
          • - Automation
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Anodizing Equipment
      • Anodizing Mini-Plant
      • Apex Modular Anodizing Equipment
      • Custom Anodizing Equipment
      • Titanium Anodizing Equipment
      • Anodizing Resources
        • What Anodizing System if right for me.
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        • Demonstration Videos
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          • Advanced Engineered Systems
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
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    • Global Offices & Distributors
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        • Tape Application Jig
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    • Contact Us
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    • Global Facilities
      • EU Distributors
    • ISO 9001 Registration Certificate
    • Technic SDS Access