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Technic Semcon 2000 - Wafer Plating Tool

Semcon 2000 - Advanced Multiprocess Electroplating

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Multi-Metal Electroplating Tool for R&D and Limited Volume Production

semcon%202000%20web.jpg

Semcon%202000%20web%202_0.jpgTechnic’s Semcon 2000 expands on the success of the Semcon 1000, a single process manual electroplating tool, by providing customers with a multiprocess version offering more options for system layout and configurations. Because of its modular construction, the customer can customize the tool to incorporate all required components needed for specific applications. The system can incorporate multiple cleaning, electroplating, rinsing, and other chemical processing all within an easy-to-manage tool that can accommodate any size and shape wafer to 200mm. The Semcon 2000 is extremely versatile with an easy-to-operate HMI interface for process monitoring of all key functions. 

Constructed and designed with enhanced operator safety features, easy-access controls, and quick access to maintenance areas, the Semcon 2000 is fully compatible with any commercially available electroplating and ancillary chemistries. Construction options include FM-4910 specifications and SEMI S2-0200 Certification.

Semcon 2000 Semiconductor Plating Equipment Fact Sheet

Multi-Metal Electroplating Tool

Features

  • Available single and double wafer plating cells with pretreatment, QDRand dragout rinsing, and reciprocating drying station.
  • Closed-loop flow control with reciprocating sparger, in-line filter with replacement alarm, and solution sample ports.
  • Easy, touch screen HMI control panel for monitoring of all key operations and functions. Dual controls available for service chase installations.
  • Programmable recipe controls for DC, pulse, and PPR rectifiers.
  • Datalogging with wafer-based report generation at the tool or via OPC interface.
  • Open and dry backside plating fixtures are available.
  • Automatic hands-free filling and dosing systems are available. Including software interface with automatic solution analysis equipment.

Benefits

  • Multiple process configurations in a single tool: cleaning, electroplating, stripping, and etching.
  • Capable of processing a variety of substrates including Si, GaAs, InP, and others.
  • Customizable configuration to meet the customer’s requirements.
  • Ongoing technical support with industry-leading chemistry – Technic supplies a wide range of advanced electroplating
  • chemistries – providing for quick development of optimum process parameters.
     
Download Semcon 2000 Fact Sheet

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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Semiconductor Equipment
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • ECLC Chemistry
        • Connectors
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • ECLC Equipment
    • Printed Circuit Boards
      • Chemistry
        • Final Finishes
          • ENIG & ENEPIG
        • Electrolytic Copper
        • Electrolytic Nickel & Precious Metals
        • Metallization
        • Microetchants
      • Imaging Products
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Anodizing Equipment
    • Solar
      • Deposition Chemistry
      • Plating Resist for Solar
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post-Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • 3D-Printing
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Engineered Powders
    • Products
    • Global Representatives
    • Safety Data Sheets (SDSs)
    • Daily Metal Prices
    • Conflict Minerals Report Request
    • ISO 9001:2015 Certification
    • Contact Us
  • Analytical Controls
    • Capabilities
      • Electroanalytical Methods
      • Data Analysis
      • Volumetric Analysis
    • Process Control Products
      • Real Time Analyzer (RTA)
        • RTA 3D
        • RTA Classic
        • ACE
        • SSF RTA 3D
        • PHD Option
      • EBA
        • EBA 3D
        • EBA 3D: Plus Option
        • EBA Classic
        • Technic Elevate Analyzer
      • Automatic Process Titrator
        • Maestro
        • NextChem Analyzer Support
    • Electrochemical Research Instrumentation
  • About
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      • Senior Key Account Manager – Specialty Chemical Semiconductor (Europe)
      • Electrical Controls Hardware Designer
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