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Copper plating chemistry for semiconductor applications on wafer.

Copper Electroplating Chemistry

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Copper Plating for Advanced Semiconductor Packaging


As the semiconductor industry moves to more advanced packaging structures, the use of copper plating has continued to grow. Along with this growth, the requirements on the copper plating solutions and deposit have become more demanding. Technic’s Elevate® Copper products are formulated to meet these demanding requirements such as high-speed plating, excellent coplanarity, and very low deposit roughness.

From very tight RDL (redistribution layer) patterns with 2 micron spaces, to 200 micron tall copper pillars, the Elevate® Copper processes can be adjusted to offer optimum results on a variety of semiconductor packaging platforms including FOWLP (Fan Out Wafer Level Packaging), Fan-In WLP (Fan-In Wafer Level Packaging), Flip Chip and 2.5D/3D.

All Elevate® Copper processes can be monitored with our industry leading Technic Elevate® Analyzer. In addition, we offer unparalleled customer service that has made Technic a respected resource for quality around the globe.

Copper Plating Bath, Elevate® Cu 6370

Elevate® Cu 6370

High-speed copper plating bath able to achieve very fast plating rates on a variety of semiconductor applications while maintaining good WIW and WID coplanarity. 4 microns/minute or more can be attained on bump on passivation, bump on pad, and other advanced packaging structures while maintaining a WIW of <10% and a WID of <5%.  Standard pillars, mega pillars, and RDL structures can all be plated successfully with Elevate® Cu 6370.  

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Copper semiconductor electroplating bath, Elevate® 6340

Elevate® Cu 6340

A low-stress copper bath that can be used for any application that requires a low-stress deposit such as a glass substrate. Plates at 1 – 2 microns/minute with virtually no internal stress.

 

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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Semiconductor Equipment
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • Electronic Component Chemistry
        • Connectors
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • Electronic Component Finishing Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Masks, Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
      • Imaging Products
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Anodizing Equipment
    • Solar
      • Deposition Chemistry
      • Plating Resist for Solar
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post-Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • 3D-Printing
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Engineered Powders
    • Products
    • Global Representatives
    • Safety Data Sheets (SDSs)
    • Daily Metal Prices
    • Conflict Minerals Report Request
    • ISO 9001:2015 Certification
    • Contact Us
  • Analytical Controls
    • Capabilities
      • Electroanalytical Methods
      • Data Analysis
      • Volumetric Analysis
    • Process Control Products
      • Real Time Analyzer (RTA)
        • RTA 3D
        • RTA Classic
        • ACE
        • SSF RTA 3D
        • PHD Option
      • EBA
        • EBA 3D
        • EBA 3D: Plus Option
        • EBA Classic
        • Technic Elevate Analyzer
      • Automatic Process Titrator
        • Maestro
        • NextChem Analyzer Support
    • Electrochemical Research Instrumentation
  • About
    • Contact Us
    • News & Events
      • Upcoming Trade Shows
      • Recent Trade Shows
      • Technic Webinars
    • Environmental Stewardship
    • Industry Partners
    • Conflict Minerals Reporting
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      • Resource Library
      • Videos
      • Useful Tools
      • Daily Metal Prices
      • FAQ
    • Careers
      • R&D Powder Scientist
      • Senior Key Account Manager – Specialty Chemical Semiconductor (Europe)
      • Electrical Controls Hardware Designer
      • Sales Support Associate
    • Global Facilities
      • EU Distributors
    • Technic SDS Access