Pre-clean and Microetching Chemistry
High-performance preparation for PCB fabrication
Technic provides an exceptional rage of pre-clean and microetch products for today's Printed Circuit Manufacturing. Contact your Technic Representive or reach out to us so we may assist with your specific requirements and application.
Techni X-Cell 318 is a liquid acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys. Techni X-Cell 318 can be used in either soak or spray (318 LF) applications, or electrolytically. The balanced blend of surfactants not only provides more effective soil removal but allows for an easily rinsed surface as well. Techni X-Cell 318 is compatible with most dry films and screening resists. Techni X-Cell 318 may also be used all applications where alkaline cleaning is not desirable. It is particularly effective in removing oxides, organic contaminants, and resist residues on electroless and electroplated copper surfaces before printed circuit board SMT applications.
TechniClean 207 AP is a liquid low-foam acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys. TechniClean 207 AP can be used in either soak or spray applications. The balanced blend of chemistry not only provides effective soil removal but allows for an easily rinsed surface. It does not contain any RoHS-restricted materials, chelating agents, or Phosphorus. TechniClean 207 AP is effective in removing oxides and organic contaminants on electroless and electroplated copper surfaces before copper plating. It is compatible with most dry films and screening resists.
TechniClean TH 1020 is an acidic NPTH cleaner designed to stop electroless nickel from depositing in non-plated through holes. It renders catalyst residues left behind by electroless copper processes inactive, stopping electroless nickel from depositing. TechniClean TH 1020 has a very low surface tension allowing excellent wetting of fine features and through holes. It is used as the first process step in the TechniPad ENIG or TechniPad ENEPIG processes. It is easy to rinse and will remove oxides, light oils, and fingerprints on the copper surface leaving a bright active substrate for further processing.
Micro-Etching - TechniEtch
TechniEtch AT 2000 is an ammonia-free, fine topography persulfate micro etch designed for use in pretreatment cycles for printed circuit boards and other copper surfaces. TechniEtch AT 2000 is particularly effective in etching both electroless and electroplated copper surfaces before processing through electroless nickel and immersion gold, as well as many copper surfaces commonly used in connector and lead frame manufacturing processes. TechniEtch AT 2000 can also be used for the removal of thin copper deposits from belts/clips on web-to-web flexible PCB plating equipment.
Techni CU 85 is a heavy-duty ammonia-free peroxysulfate micro etch specifically designed to deoxidize and/or activate copper surfaces before electroplating. Techni CU 85 can also be used on Alloy 42 substrates.
TechniEtch 1118 is a proprietary ammonia-free, persulfate micro etch designed to provide improved topography over standard persulfate and peroxide chemistry at the same etch depth. This topography will improve resist, Solder Mask, or plating adhesion which becomes critical when processing parts with fine features. The micro-etch is effective for both electroless and electroplated copper surface treatment and will provide additional cleaning and some tarnish resistance. TechniEtch 1118 can be used in horizontal or vertical equipment and applications including surface treatment before resist, Solder Mask electrolytic and electroless copper plating, and many copper surfaces commonly used in connector and lead-frame manufacturing processes. Extremely low consumption and extremely stable.
Techni ME 200 is a Liquid micro-etch capable of uniform, copper removal. It can be used like any powder Micro-etch used in the Printed Circuits Boards fabrication. It is 100% liquid and extremely stable even under low control.