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Boron-Free, Liquid pH Buffer for Nickel Electroplating
Lodi Vecchio, Italy – Technic Italgalvano is proud to announce the release of Techni Buffer IG, a new boron-free pH buffer for nickel plating applications. The demand for boron-free products is steadily growing, especially in Europe, where boric acid has been included in the SVHC list as a dangerous, reprotoxic substance. Techni Buffer IG, designed for both general metal finishing and decorative applications, has been developed to address the growing demand for a boron-free, high-performance nickel process.
The nickel bath with Techni Buffer IG prevents the formation of nickel hydroxide (which typically leads to increasing pH in the process, thus decreasing leveling capabilities and brightness) and it does not alter the working pH, so it has the same characteristics of a nickel bath with boric acid.
As the removal of boron from wastewater can be quite difficult, replacing it with Techni Buffer IG allows safer, more environmentally responsible wastewater management and this reduces cost.
Attempts to replace boric acid with alternative products would typically reduce the brighteners’ leveling power, producing dull deposits. Techni Buffer IG produces bright, leveled, lower stress deposits, even compared to boric-acid based solutions. Thanks to its liquid form, Techni Buffer IG also prevents issues caused by boric acid not fully dissolving in the nickel bath, such as crystallization and solid particles. Our customers have been delighted with the results.
- Silvia Maiocchi, Technical Support Manager, Technic Italgalvano
Ready to Learn More about the Technical Advantages of Techni Buffer IG?
Join one of our upcoming webinars.
Thursday, 11/5/20 at 9:00am EST.
(Presented in Italian)
Click Here to Register
Tuesday, 11/17/20 at 9:00am EST.
(Presented in English)
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