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Safer, Cleaner, More Economical Solutions
The electroplating industry is under an increasing amount of pressure due to new regulations that are impacting the current and future use of chemicals.
In Europe, the industry is required to work on minimizing the use of carcinogenic, toxic for reproduction and mutagenic substances (H340, H350 and H360), as well as Substances of Very High Concern (SVHC). In this context, the Technic group continues to be a leader in the development of chemical solutions that are free of toxic components and safer for the environment, while continuing to guarantee high performance.
With this in mind, Technic renews its involvement in R&D activities, aiming to create a new generation of products that offer excellent performance, while improving the sustainability of processes at the same time.
Technic's Eco Products 
This project is a constantly evolving path where we will strive to propose innovative solutions, based on the specific requests of our customers, of market needs or new regulations. For example, boric acid has been classified as a “Substance of Very High Concern” (SVHC) and its use is now subjected to regulation.
Below we present four innovative products, which provide valid alternatives to processes that have been in use in the industry for decades, such as nickel and copper plating.
Glance Cu 160
Alkaline, cyanide free copper plating process, which produces a fine-grained, smooth copper deposit, free from porosity with excellent binding properties.
Advantages:
• Does not require any pre-copper plating operation
• Does not pose any risk to the environment and human health
• Simpler, cheaper wastewater treatment
• Does not require treatment of carbonates
• Offers financial benefits, thanks to significantly lower metal concentration of copper vs. cyanide-based solutions
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Techni Buffer IG
Revolutionary boric free nickel plating processes based on sulphate, sulphamate and Goldeneye Nickel, using a new pH buffering system to replace boric acid.
Advantages:
• Liquid form, easy to add
• Does not increase pH (no formation of nickel hydroxide)
• Free from Substances of Very High Concern (SVHC)
• Low stress of the nickel deposit
• Simpler, cheaper wastewater treatment
• Boric-based solutions can easily be converted to Techni Buffer IG
Elevate Ni 5950
Unique boric free, electrolytic nickel for semiconductor applications, which produces nickel deposits with comparable attributes to a standard nickel electroplating solution.
Advantages:
• High efficiency
• Very stable solution over the life of the bath
• Ideal for use in wafer fabs, thanks to its all liquid components
• Low stress, semi-bright deposit
• Operates up to 10 ASD
Cyless Electrolytic AU Strip TC
Electrolytic gold stripper.
Removes gold from most base metals.
Advantages:
• Cyanide free
• Very stable solution over the life of the bath
• Removes gold from nickel and nickel alloy substrate
