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Industry-Leading Photoimageable Solder Mask Series
Our LDI and UV compatible photoimageable inks, either epoxy or polyimide based, are ideal for creating intricate PWB circuit patterns with precision.
The TechniFlex™ LCL 1000F series combines flexibility, tight dimensional accuracy, and high thermal resistance for demanding flex applications:
- TechniFlex™ LCL1000F/423M U9F - our latest black matte flexible solder mask: low exposure energy, high heat resistance, and improved flux resistance over earlier generations.
- TechniFlex™ LCL 1000F/421M U8 - black, high-heat-resistance flexible solder mask for direct imaging.
- TechniFlex™ LCL 1000F/423M U7 series - for either direct imaging/manual exposure or roll to roll coating operations.
- TechniFlex™ LCL 1000F/421M U6 - for direct imaging/manual exposure.
TechniFlex™ LCL1000F/423M U9F
Liquid photoimageable flexible black matte solder mask, designed for low exposure energy on high-output direct imaging (UV, LED and multiple-laser) systems.
Testing shows U9F tolerates substantially more flux before failure than the previous generation — roughly 8.5% failure at 60 mg/in² vs nearly 40% for U7S-P.
- Halogen- and active-silicone-free.
- Reduced undercut, thanks to a new pigment system with improved light penetration.
- Higher heat resistance for multiple soldering and hot-bar processing.
- Enhanced adhesion to underfills and adhesives, from the active-silicone-free formulation.
TechniFlex™ LCL 1000F/421M U8
Liquid photo-definable flexible black matte solder mask. This product is specially designed for low exposure energy, with recently available high-output direct imaging systems.
- RoHS compliant and free from bisphenol A, halogen, Sb, Be, and phthalate.
- No cracking after multiple 180-degree bends, even when processing 12-micron polyimide substrate.
- High resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes.
- Less than 10 microns of undercut.
